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Toshiba Semiconductor |
MOSFETs Silicon N-Channel MOS (U-MOS)
TPCF8004
1. Applications
• Lithium-Ion Secondary Batteries
2. Features
(1) Small footprint due to a small and thin package
(2) Low drain-source on-resistance: RDS(ON) = 19 mΩ (typ.) (VGS = 10 V)
(3) Low leakage current: IDSS = 10 µA (max) (VDS = 30 V)
(4) Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 0.1 mA)
3. Packaging and Internal Circuit
TPCF8004
1, 2, 3, 6, 7, 8: Drain
4: Gate
5: Source
VS-8
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Rating
Unit
Drain-source voltage
VDSS 30 V
Gate-source voltage
VGSS
±20
Drain current (DC)
(Note 1)
ID
7A
Drain current (pulsed)
(Note 1)
IDP
28
Power dissipation
(t = 5 s)
(Note 2)
PD
2.5 W
Power dissipation
(t = 5 s)
(Note 3)
PD
0.7 W
Single-pulse avalanche energy
(Note 4)
EAS
31 mJ
Avalanche current
IAR 7 A
Channel temperature
Tch 150
Storage temperature
Tstg -55 to 150
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1 2012-08-28
Rev.1.0
5. Thermal Characteristics
Characteristics
Channel-to-ambient thermal resistance
Channel-to-ambient thermal resistance
(t = 5 s)
(t = 5 s)
(Note 2)
(Note 3)
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Device mounted on a glass-epoxy board (a), Figure 5.1
Note 3: Device mounted on a glass-epoxy board (b), Figure 5.2
Note 4: VDD = 24 V, Tch = 25 (initial), L = 0.5 mH, RG = 1 Ω, IAR = 7 A
TPCF8004
Symbol
Rth(ch-a)
Rth(ch-a)
Max
50
178.5
Unit
/W
/W
Fig. 5.1 Device Mounted on a Glass-Epoxy
Board (a)
Fig. 5.2 Device Mounted on a Glass-Epoxy
Board (b)
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.
2 2012-08-28
Rev.1.0
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