파트넘버.co.kr BUK9606-55A 데이터시트 PDF


BUK9606-55A 반도체 회로 부품 판매점

TrenchMOS transistor Logic level FET



NXP Semiconductors 로고
NXP Semiconductors
BUK9606-55A 데이터시트, 핀배열, 회로
Philips Semiconductors
TrenchMOStransistor
Logic level FET
Product specification
BUK9606-55A
GENERAL DESCRIPTION
N-channel enhancement mode logic
level field-effect power transistor in a
plastic envelope suitable for surface
mounting. Using ’trench’ technology
the device features very low on-state
resistance. It is intended for use in
automotive and general purpose
switching applications.
PINNING - SOT404
PIN DESCRIPTION
1 gate
2 drain (no connection
possible)
3 source
mb drain
QUICK REFERENCE DATA
SYMBOL PARAMETER
VDS
ID
Ptot
Tj
RDS(ON)
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
VGS = 5 V
VGS = 10 V
MAX.
55
75
230
175
6.3
5.8
PIN CONFIGURATION
SYMBOL
d
mb
2
13
g
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
VDS
VDGR
±VGS
±VGSM
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Non-repetitive gate-source voltage
-
RGS = 20 k
-
tp50µS
ID
ID
IDM
Ptot
Tstg, Tj
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage & operating temperature
Tmb = 25 ˚C
Tmb = 100 ˚C
Tmb = 25 ˚C
Tmb = 25 ˚C
-
THERMAL RESISTANCES
SYMBOL
Rth j-mb
Rth j-a
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
CONDITIONS
-
Minimum footprint, FR4
board
MIN.
-
-
-
-
-
-
-
-
- 55
MAX.
55
55
10
15
75
75
240
230
175
TYP.
-
50
MAX.
0.65
-
UNIT
V
A
W
˚C
m
m
UNIT
V
V
V
V
A
A
A
W
˚C
UNIT
K/W
K/W
January 1999
1
Rev 1.000


BUK9606-55A 데이터시트, 핀배열, 회로
Philips Semiconductors
TrenchMOStransistor
Logic level FET
Product specification
BUK9606-55A
STATIC CHARACTERISTICS
Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
V(BR)DSS
VGS(TO)
IDSS
IGSS
RDS(ON)
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain current
Gate source leakage current
Drain-source on-state
resistance
VGS = 0 V; ID = 0.25 mA;
Tj = -55˚C
VDS = VGS; ID = 1 mA
Tj = 175˚C
Tj = -55˚C
VDS = 55 V; VGS = 0 V;
Tj = 175˚C
VGS = ±10 V; VDS = 0 V
VGS = 5 V; ID = 25 A
Tj = 175˚C
VGS = 10 V; ID = 25 A
VGS = 4.5 V; ID = 25 A
MIN.
55
50
1
0.5
-
-
-
-
-
-
-
-
TYP.
-
-
1.5
-
-
0.05
-
2
5.3
-
4.8
-
MAX.
-
-
2.0
-
2.3
10
500
100
6.3
13.2
5.8
6.7
UNIT
V
V
V
V
V
µA
µA
nA
m
m
m
m
DYNAMIC CHARACTERISTICS
Tmb = 25˚C unless otherwise specified
SYMBOL PARAMETER
Ciss Input capacitance
Coss Output capacitance
Crss Feedback capacitance
td on Turn-on delay time
tr Turn-on rise time
td off Turn-off delay time
tf Turn-off fall time
Ld Internal drain inductance
Ls Internal source inductance
CONDITIONS
VGS = 0 V; VDS = 25 V; f = 1 MHz
VDD = 30 V; Rload =1.2;
VGS = 5 V; RG = 10
Measured from upper edge of drain
tab to centre of die
Measured from source lead
soldering point to source bond pad
MIN.
-
-
-
-
-
-
-
-
-
TYP.
6500
1000
650
45
180
420
235
2.5
7.5
MAX.
8600
1200
850
65
270
590
330
-
UNIT
pF
pF
pF
ns
ns
ns
ns
nH
- nH
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tj = 25˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
IDR Continuous reverse drain
current
IDRM Pulsed reverse drain current
VSD Diode forward voltage
IF = 25 A; VGS = 0 V
IF = 75 A; VGS = 0 V
trr Reverse recovery time IF = 75 A; -dIF/dt = 100 A/µs;
Qrr
Reverse recovery charge
VGS = -10 V; VR = 30 V
AVALANCHE LIMITING VALUE
SYMBOL PARAMETER
WDSS
Drain-source non-repetitive
unclamped inductive turn-off
energy
CONDITIONS
ID = 75 A; VDD 25 V;
VGS = 5 V; RGS = 50 ; Tmb = 25 ˚C
MIN. TYP. MAX. UNIT
- - 75 A
- - 240 A
- 0.85 1.2 V
- 1.1 -
V
- 80 - ns
- 0.2 - µC
MIN. TYP. MAX. UNIT
- - 500 mJ
January 1999
2
Rev 1.000




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BUK9606-55A transistor

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