AFBR-5803ATZ 반도체 회로 부품 판매점
FDDI : 100 Mb/s ATM : and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style
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 Agilent |
www.DataSheet4U.com
AFBR-5803Z/5803TZ/5803AZ/5803ATZ
FDDI, 100 Mb/s ATM, and Fast Ethernet
Transceivers in Low Cost 1 x 9 Package
Style
Data Sheet
Description
The AFBR-5800Z family of
transceivers from Agilent
provide the system designer
with products to implement a
range of Fast Ethernet, FDDI
and ATM (Asynchronous
Transfer Mode) designs at the
100 Mb/s-125 MBd rate.
The transceivers are all
supplied in the industry
standard 1 x 9 SIP package
style with either a duplex SC
or a duplex ST* connector
interface.
FDDI PMD, ATM and Fast Ethernet
2 km Backbone Links
The AFBR-5803Z/5803TZ are
1300 nm products with optical
performance compliant with
the FDDI PMD standard. The
FDDI PMD standard is ISO/IEC
9314-3:
1990 and ANSI X3.166 - 1990.
These transceivers for 2 km
multimode fiber backbones are
supplied in the small 1 x 9
duplex SC or ST package style.
The AFBR-5803Z/5803TZ is
useful for both ATM 100 Mb/s
interfaces and Fast Ethernet
100 Base-FX interfaces. The
ATM Forum User-Network
Interface (UNI) Standard,
Version 3.0, defines the
Physical Layer for 100 Mb/s
Multimode Fiber Interface for
ATM in Section 2.3 to be the
FDDI PMD Standard. Likewise,
the Fast Ethernet Alliance
defines the Physical Layer for
100 Base-FX for Fast Ethernet
to be the FDDI PMD Standard.
ATM applications for physical
layers other than 100 Mb/s
Multimode Fiber Interface are
supported by Agilent. Products
are available for both the
single mode and the multi-
mode fiber SONET OC-3c
(STS-3c) ATM interfaces and
the 155 Mb/s-194 MBd multi-
mode fiber ATM interface as
specified in the ATM Forum
UNI.
Contact your Agilent sales
representative for information
on these alternative Fast
Ethernet, FDDI and ATM
products.
Features
• Full compliance with the optical
performance requirements of the
FDDI PMD standard
• Full compliance with the FDDI
LCF-PMD standard
• Full compliance with the optical
performance requirements of the
ATM 100 Mb/s physical layer
• Full compliance with the optical
performance requirements of
100 Base-FX version of IEEE 802.3u
• Multisourced 1 x 9 package style
with choice of duplex SC or
duplex ST* receptacle
• Wave solder and aqueous wash
process compatible
• Single +3.3 V or +5 V power
supply
• RoHS Compliance
Applications
• Multimode fiber backbone links
• Multimode fiber wiring closet to
desktop links
• Very low cost multimode fiber
links from wiring closet to
desktop
• Multimode fiber media converters
*ST is a registered trademark of AT&T
Lightguide Cable Connectors.
Transmitter Sections
The transmitter section of the
AFBR-5803Z and AFBR-5805Z
series utilize 1300 nm Surface
Emitting InGaAsP LEDs. These
LEDs are packaged in the
optical subassembly portion of
the transmitter section. They
are driven by a custom silicon
IC which converts differential
PECL logic signals, ECL
referenced (shifted) to a +3.3 V
or +5 V supply, into an analog
LED drive current.
Receiver Sections
The receiver sections of the
AFBR-5803Z and AFBR-5805Z
series utilize InGaAs PIN
photodiodes coupled to a
custom silicon transimpedance
preamplifier IC. These are
packaged in the optical sub-
assembly portion of the
receiver.
These PIN/preamplifier combi-
nations are coupled to a
custom quantizer IC which
provides the final pulse
shaping for the logic output
and the Signal Detect function.
The data output is differential.
The signal detect output is
single-ended. Both data and
signal detect outputs are PECL
compatible, ECL referenced
(shifted) to a +3.3 V or +5 V
power supply.
Package
The overall package concept
for the Agilent transceivers
consists of the following basic
elements; two optical
subassemblies, an electrical
subassembly and the housing
as illustrated in Figure 1 and
Figure 1a.
The package outline drawings
and pin out are shown in
Figures 2, 2a and 3. The
details of this package outline
and pin out are compliant
with the multisource definition
of the 1 x 9 SIP. The low
profile of the Agilent
transceiver design complies
with the maximum height
allowed for the duplex SC
connector over the entire
length of the package.
www.DataSheet4U.com
The outer housing including
the duplex SC connector
receptacle or the duplex ST
ports is molded of filled
nonconductive plastic to
provide mechanical strength
and electrical isolation. The
solder posts of the Agilent
design are isolated from the
circuit design of the
transceiver and do not require
connection to a ground plane
on the circuit board.
The optical subassemblies
utilize a high volume assembly
process together with low cost
lens elements which result in a
cost effective building block.
The electrical subassembly
consists of a high volume
multilayer printed circuit
board on which the IC chips
and various surface-mounted
passive circuit elements are
attached.
The transceiver is attached to
a printed circuit board with
the nine signal pins and the
two solder posts which exit
the bottom of the housing. The
two solder posts provide the
primary mechanical strength to
withstand the loads imposed
on the transceiver by mating
with duplex or simplex SC or
ST connectored fiber cables.
The package includes internal
shields for the electrical and
optical subassemblies to ensure
low EMI emissions and high
immunity to external EMI
fields.
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
ELECTRICAL SUBASSEMBLY
DUPLEX SC
RECEPTACLE
PIN PHOTODIODE
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
DRIVER IC
LED
Figure 1. SC Connector Block Diagram.
TOP VIEW
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제조업체: Agilent
( agilent )
AFBR-5803ATZ transceiver
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AFBR-5803ATZ
FDDI : 100 Mb/s ATM : and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style - Agilent
