H3LIS200DL 반도체 회로 부품 판매점
MEMS motion sensor
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 STMicroelectronics |
H3LIS200DL
MEMS motion sensor:
low-power high-g 3-axis digital accelerometer
Datasheet - production data
TFLGA 3x3x1.0 mm3 16L
Features
Wide supply voltage, 2.16 V to 3.6 V
Low-voltage compatible IOs, 1.8 V
Ultra-low power consumption down to 10 μA in
low-power mode
±100g/±200g dynamically selectable full scales
I2C/SPI digital output interface
8-bit data output
Sleep-to-wakeup function
10000 g high shock survivability
ECOPACK®, RoHS and “Green” compliant
Description
The H3LIS200DL is a low-power high-
performance 3-axis linear accelerometer
belonging to the “nano” family, with digital I2C/SPI
serial interface standard output.
The device features ultra-low-power operational
modes that allow advanced power saving and
smart sleep-to-wakeup functions.
The H3LIS200DL has dynamically user-
selectable full scales of ±100g/±200g and is
capable of measuring accelerations with output
data rates from 0.5 Hz to 1 kHz.
The H3LIS200DL is available in a small thin
plastic land grid array package (LGA) and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Applications
Shock detection
Impact recognition and logging
Order codes
H3LIS200DLTR
Table 1. Device summary
Temperature range [C]
Package
-40 to +85
TFLGA 3x3x1.0 mm3 16L
Packaging
Tape and reel
April 2015
This is information on a product in full production.
DocID027505 Rev 2
1/38
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Contents
Contents
H3LIS200DL
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.1
2.3.2
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.3 Sleep-to-wakeup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.2.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2.3 SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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PDF 파일 내의 페이지 : 총 30 페이지
제조업체: STMicroelectronics
( stm )
H3LIS200DL sensor
데이터시트 다운로드 :
[ H3LIS200DL.PDF ]
[ H3LIS200DL 다른 제조사 검색 ]
국내 전력반도체 판매점
상호 : 아이지 인터내셔날
전화번호 : 051-319-2877
[ 홈페이지 ]
IGBT, TR 모듈, SCR, 다이오드모듈, 각종 전력 휴즈
( IYXS, Powerex, Toshiba, Fuji, Bussmann, Eaton )
전력반도체 문의 : 010-3582-2743
