ZSSC3224 반도체 회로 부품 판매점
High End 24-Bit Sensor Signal Conditioner IC
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 IDT |
High End 24-Bit Sensor Signal
Conditioner IC
ZSSC3224
Datasheet
Brief Description
The ZSSC3224 is a sensor signal conditioner (SSC) IC
for high-accuracy amplification and analog-to-digital con-
version of a differential or pseudo-differential input
signal. Designed for high-resolution sensor module
applications, the ZSSC3224 can perform offset, span,
and 1st and 2nd order temperature compensation of the
measured signal. Developed for correction of resistive
bridge or absolute voltage sensors, it can also provide a
corrected temperature output measured with an internal
sensor.
The measured and corrected sensor values are provided
at the digital output pins, which can be configured as I2C
(≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of
signal offset, sensitivity, temperature, and non-linearity is
accomplished via a 26-bit internal digital signal
processor (DSP) running a correction algorithm.
Calibration coefficients are stored on-chip in a highly
reliable, non-volatile, multiple-time programmable (MTP)
memory. Programming the ZSSC3224 is simple via the
serial interface. The interface is used for the PC-
controlled calibration procedure, which programs the set
of calibration coefficients in memory. The ZSSC3224
provides accelerated signal processing, increased
resolution, and improved noise immunity in order to
support high-speed control, safety, and real-time sensing
applications with the highest requirements for energy
efficiency.
Features
Flexible, programmable analog front-end design; up
to 24-bit analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing
sensor signals: gain range 6.6 to 216 (linear)
Internal auto-compensated 18-bit temperature sensor
Digital compensation of individual sensor offset; 1st
and 2nd order digital compensation of sensor gain as
well as 1st and 2nd order temperature gain and offset
drift
Programmable interrupt operation
High-speed sensing: e.g., 18-bit conditioned sensor
signal measurement rate >200s-1
Typical sensor elements can achieve an accuracy of
better than ±0.10% FSO* at -40 to 85°C
Benefits
Integrated 26-bit calibration math digital signal
processor (DSP)
Fully corrected signal at digital output
Layout customized for die-die bonding with sensor for
high-density chip-on-board assembly
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components
required
Highly integrated CMOS design
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute voltage
(e.g., thermopile) sensor modules
Physical Characteristics
Supply voltage range: 1.68V to 3.6V
Operating mode current: ~1.0mA (typical)
Sleep Mode current: 20nA (typical)
Temperature resolution: <0.7mK/LSB
Excellent energy-efficiency:
with 18-bit resolution: <100pJ/step
with 24-bit resolution: <150nJ/step
Operation temperature: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding
* FSO = Full Scale Output.
ZSSC3224 Application Example
VSS
RES
EOC
MISO
VDD
Stacked-Die Sensor Module
VDD
VSS
RES
ZSSC3224
VDDB
INP(+)
SS
VDDB
INN
EOC
MISO
sensor element
INN(-)
VSSB
INP
VSSB
MOSI
SDA
SCLK
SCL
VSS
VDD
Battery
SS
MOSI
SDA
SCLK
SCL
Microcontroller
© 2016 Integrated Device Technology, Inc
1
October 24, 2016
ZSSC3224 Datasheet
ZSSC3224
Block Diagram
Sensor
Bridge
Applications
Barometric altitude measurement for
portable navigation or emergency call
systems
Altitude measurement for car navigation
Weather forecast
Fan control
Industrial, pneumatic, and liquid pressure
High-resolution temperature measurements
Object-temperature radiation (via thermopile)
VDDB
VTP Temperature
Reference
VTN Sensor
INP
INN
VSSB
Power-ON
Reset
AGND / CM
Generator
Vreg int
Bias Current
Generator
Voltage
Regulator
Power Ctr.
ZSSC3224
Pre-
Amplifier
A
D
24 Bit
DSP Core
(Calculations,
Communication)
Clock
Generator
Oscillator
System
Control
Unit
MTP
SPI
I²C
VDD
VSS
EOC
SCLK/SCL
SS
MOSI/SDA
MISO
RES
Sales Code
ZSSC3224BI1B
ZSSC3224BI2B
ZSSC3224BI3R ES
ZSSC3224-KIT
Description
Die—temperature range: –40°C to +85 °C; thickness 304µm
Die—temperature range: –40°C to +85 °C; thickness 725µm
(without backlapping)
PQFN24—temperature range: –40°C to +85 °C; engineering samples
(note: the PQFN24 package is only available as engineering samples)
Package
Unsawn wafer
Unsawn wafer
Packaged die
Evaluation Kit for ZSSC3224, including boards, cable, software, and 5 samples
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guarante ed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, includin g, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey an y license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc
2
October 24, 2016
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ZSSC3224 sensor
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