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Formosa MS |
Super Low VF Chip Schottky Barrier Rectifier
SSL14 / SLL14
Formosa MS
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information...........................................................................4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities...........................................................7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
DS-12160S
Issued Date
2008/02/10
RevisedDate
2009/02/10
Revision
C
Page.
7
Super Low VF Chip Schottky Barrier Rectifier
SSL14 / SLL14
Formosa MS
1.0A Surface Mount Super Low Forward
Schottky Barrier Rectifiers - 40V
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "-H" indicates Halogen-free part, ex.SSL14-H.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMA
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.05 gram
SMA
0.196(4.9)
0.180(4.5)
0.012(0.3) Typ.
0.106(2.7)
0.091(2.3)
0.032(0.8) Typ.
0.068(1.7)
0.060(1.5)
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
Maximum ratings (AT TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Symbol
Forward rectified current
See Fig.2
IO
Forward surge current
8.3ms single half sine-wave superimposed on SSL14
rate load (JEDEC methode)
SLL14
IFSM
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
VR = VRRM TA = 25 OC
VR = VRRM TA = 125 OC
Junction to ambient
f=1MHz and applied 4V DC reverse voltage
IR
RèJA
CJ
TSTG
MIN.
-65
TYP. MAX. UNIT
1.0 A
90 A
70
1.0
mA
10
50 OC/W
300 pF
+175 OC
SYMBOLS
SSL14
SLL14
V
R
*
RM
1
(V)
40
40
V
*
RMS
2
(V)
28
28
V
*
R
3
(V)
40
40
V
*
F
4
(V)
0.32
0.34
Operating
temperature
TJ, (OC)
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage @1.0A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
DS-12160S
Issued Date
2008/02/10
RevisedDate
2009/02/10
Revision
C
Page.
7
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