DS8837M 반도체 회로 부품 판매점
Hex Unified Bus Receiver
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 National Semiconductor |
February 1996
DS7837 DS8837 Hex Unified Bus Receiver
General Description
The DS7837 DS8837 are high speed receivers designed for
use in bus organized data transmission systems intercon-
nected by terminated 120X impedance lines The external
termination is intended to be 180X resistor from the bus to
the a5V logic supply together with a 390X resistor from the
bus to ground The receiver design employs a built-in input
hysteresis providing substantial noise immunity Low input
current allows up to 27 driver receiver pairs to utilize a com-
mon bus Disable inputs provide time discrimination Disable
inputs and receiver outputs are TTL compatible Perform-
ance is optimized for systems with bus rise and fall times
s1 0 ms V
Features
Y Low receiver input current for normal VCC or VCC e 0V
(15 mA typ)
Y Six separate receivers per package
Y Built-in receiver input hysteresis (1V typ)
Y High receiver noise immunity (2V typ)
Y Temperature insensitive receiver input thresholds track
bus logic levels
Y TTL compatible disable and output
Y Molded or cavity dual-in-line or flat package
Y High speed
Typical Application
Connection Diagram
Dual-In-Line Package
TL F 5811 – 1
Top View
Order Number DS7837J DS8837M or DS8837N
See NS Package Number J16A M16A or N16A
TL F 5811 – 2
C1996 National Semiconductor Corporation TL F 5811
RRD-B30M36 Printed in U S A
http www national com
Absolute Maximum Ratings (Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Supply Voltage
7V
Input Voltage
5 5V
Operating Temperature Range
DS7837
DS8837
b55 C to a125 C
0 C to a70 C
Storage Temperature Range
b65 C to a150 C
Maximum Power Dissipation at 25 C
Cavity Package
Molded DIP Package
1433 mW
1362 mW
SO Package
1002 mW
Lead Temperature (Soldering 4 seconds)
260 C
Derate cavity package 9 6 mW C above 25 C derate molded DIP package
10 9 mW C above 25 C derate SO package 8 01 mW C above 25 C
Operating Conditions
Min
Supply Voltage (VCC)
DS7837
DS8837
45
4 75
Temperature (TA)
DS7837
DS8837
b55
0
Max
55
5 25
a125
a70
Units
V
V
C
C
Electrical Characteristics
The following apply for VMIN s VCC s VMAX TMIN s TA s TMAX unless otherwise specified (Notes 2 and 3)
Symbol
Parameter
Conditions
Min Typ
VTH High Level Receiver Threshold VCC e Max
DS7837
DS8837
1 65 2 25
1 80 2 25
VTL Low Level Receiver Threshold VCC e Min
DS7837
DS8837
0 97 1 30
1 05 1 30
IIH
IIL
VIH
VIL
IIH
IIL
VOH
VOL
IOS
ICC
VCL
Maximum Receiver Input Current
Logical ‘‘0’’ Receiver Input Current
Logical ‘‘1’’ Input Voltage
Logical ‘‘0’’ Input Voltage
Logical ‘‘1’’ Input Current
Logical ‘‘0’’ Input Current
Logical ‘‘1’’ Output Voltage
Logical ‘‘0’’ Output Voltage
Output Short Circuit Current
Power Supply Current
Input Clamp Diode
VIN e 4V
VCC e VMAX
VCC e 0V
VIN e 0 4V VCC e VMAX
Disable
Disable
Disable Input
VIND e 2 4V
VIND e 5 5V
VIN e 4V VIND e 0 4V Disable Input
VIN e 0 5V VIND e 0 8V
IOH e b400 mA
VIN e 4V VIND e 0 8V IOH e 16 mA
VIN e 0 5V VIND e 0V VOS e 0V
VCC e VMAX (Note 4)
VIN e 4V VIND e 0V (Per Package)
VIN e b12 mA VIND e b12 mA
TA e 25 C
20
24
b18 0
15 0
10
10
0 25
45 0
b1 0
Max
2 65
2 50
1 63
1 55
50 0
50 0
50 0
08
80 0
20
b3 2
04
b55 0
60 0
b1 5
Units
V
V
V
V
mA
mA
mA
V
V
mA
mA
mA
V
V
mA
mA
V
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DS8837M receiver
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관련 데이터시트
DS8837
Hex Unified Bus Receiver - National Semiconductor
DS8837M
Hex Unified Bus Receiver - National Semiconductor
DS8837N
Hex Unified Bus Receiver - National Semiconductor