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ACS08K 반도체 회로 부품 판매점

Radiation Hardened Quad 2-Input AND Gate



Intersil Corporation 로고
Intersil Corporation
ACS08K 데이터시트, 핀배열, 회로
www.DataSheet4U.com
ACS08MS
July 1998
Radiation Hardened
Quad 2-Input AND Gate
Features
Description
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25Micron Radiation Hardened SOS CMOS
• Radiation Environment
- Latch-up Free Under any Conditions
- Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si)
- SEU Immunity . . . . . . . . . . . <1 x 10-10 Errors/Bit/Day
- SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm2)
• Input Logic Levels . . .VIL = (0.3)(VCC), VIH = (0.7)(VCC)
• Output Current . . . . . . . . . . . . . . . . . . . . . . . ±8mA (Min)
• Quiescent Supply Current. . . . . . . . . . . . . 100µA (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . .15ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
The Radiation Hardened ACS08MS is a Quad 2-Input AND
Gate. For each gate, a HIGH level on both the A and B
inputs results in a HIGH level on the Y output. A LOW level
on either the A or B input results in a LOW level on the Y
output. All inputs are buffered and the outputs are designed
for balanced propagation delay and transition times.
The ACS08MS is fabricated on a CMOS Silicon on
Sapphire (SOS) process, which provides an immunity to
Single Event Latch-up and the capability of highly reliable
performance in any radiation environment. These devices
offer significant power reduction and faster performance
when compared to ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS08 are
contained in SMD 5962-95651. A “hot-link” is provided
on our homepage with instructions for downloading.
www.intersil.com/data/sm/index.asp
Ordering Information
ORDERING NUMBER
INTERNAL MARKETING NUMBER TEMP. RANGE (oC)
PACKAGE
5962F9565101VCC
ACS08DMSR
-55 to 125
14 Ld SBDIP
ACS08D/SAMPLE
ACS08D/SAMPLE
25 14 Ld SBDIP
5962F9565101VXC
ACS08KMSR
-55 to 125
14 Ld Flatpack
ACS08K/SAMPLE
ACS08K/SAMPLE
25 14 Ld Flatpack
5962F9565101V9A
ACS08HMSR
25 Die
Pinouts
ACS08 (SBDIP)
TOP VIEW
ACS08 (FLATPACK)
TOP VIEW
DESIGNATOR
CDIP2-T14
CDIP2-T14
CDFP4-F14
CDFP4-F14
N/A
A1 1
B1 2
Y1 3
A2 4
B2 5
Y2 6
GND 7
14 VCC
13 B4
12 A4
11 Y4
10 B3
9 A3
8 Y3
A1
B1
Y1
A2
B2
Y2
GND
1 14
2 13
3 12
4 11
5 10
69
78
VCC
B4
A4
Y4
B3
A3
Y3
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
File Number 3993.1


ACS08K 데이터시트, 핀배열, 회로
www.DataSheet4U.com
ACS08MS
Die Characteristics
DIE DIMENSIONS:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm ±25µm (20.6 mils ±1 mil)
Bond Pad: 110µm x 110µm (4.3 mils x 4.3 mils)
METALLIZATION: Al
Metal 1 Thickness: 0.7µm ±0.1µm
Metal 2 Thickness: 1.0µm ±0.1µm
SUBSTRATE POTENTIAL:
Unbiased Insulator
Metallization Mask Layout
B1
PASSIVATION
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm ±0.15µm
SPECIAL INSTRUCTIONS:
Bond VCC First
ADDITIONAL INFORMATION:
Worst Case Density: <2.0 x 105 A/cm2
Transistor Count: 176
ACS08MS
A1 VCC
B4
Y1 A4
A2 Y4
NC NC
B2 B3
Y2 GND
Y3
A3
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
2




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