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MC10H186 반도체 회로 부품 판매점

Hex D Master-Slave Flip-Flop with Reset



ON Semiconductor 로고
ON Semiconductor
MC10H186 데이터시트, 핀배열, 회로
www.DataSheet4U.com
MC10H186
Hex D Master−Slave
Flip−Flop with Reset
Description
The MC10H186 is a hex D type flipflop with common reset and
clock lines. This MECL 10Hpart is a functional/pinout duplication
of the standard MECL 10Kfamily part, with 100% improvement in
clock toggle frequency and propagation delay and no increase in
powersupply current.
Features
Propagation Delay, 1.7 ns Typical
Power Dissipation, 460 mW Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K Compatible
PbFree Packages are Available*
CLOCKED TRUTH TABLE
RC
D Qn+1
L L X Qn
L H* L
L
L H* H
H
HL
X
L
* A clock H is a clock transition from
a low to a high state.
DIP
PIN ASSIGNMENT
RESET
Q0
Q1
Q2
D0
D1
D2
VEE
1
2
3
4
5
6
7
8
16 VCC
15 Q5
14 Q4
13 Q3
12 D5
11 D4
10 D3
9 CLOCK
Pin assignment is for DualinLine Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
http://onsemi.com
MARKING DIAGRAMS*
CDIP16
L SUFFIX
CASE 620A
16
MC10H186L
AWLYYWW
1
16
16
1
PDIP16
P SUFFIX
CASE 648
MC10H186P
AWLYYWWG
1
1 20
20 1
PLLC20
FN SUFFIX
CASE 775
10H186G
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = PbFree Package
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 Rev. 7
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC10H186/D


MC10H186 데이터시트, 핀배열, 회로
MC10H186
Table 1. MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
VEE Power Supply (VCC = 0)
VI Input Voltage (VCC = 0)
Iout Output Current Continuous
Surge
8.0 to 0
0 to VEE
50
100
Vdc
Vdc
mA
TA Operating Temperature Range
0 to +75
°C
Tstg Storage Temperature Range Plastic
Ceramic
55 to +150
55 to +165
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = 5.2 V ±5%) (See Note 1.)
0° 25°
75°
Symbol
Characteristic
Min Max Min Max Min
Max Unit
IE Power Supply Current
IinH Input Current High
Pins 5,6,7,10,11,12
Pin 9
Pin 1
121 110
430 265
670 420
1250 765
121 mA
mA
265
420
765
IinL Input Current Low
0.5 0.5 0.3 mA
VOH High Output Voltage
1.02
0.84
0.98
0.81
0.92
0.735
Vdc
VOL Low Output Voltage
1.95
1.63
1.95
1.63
1.95
1.60
Vdc
VIH High Input Voltage
1.17
0.84
1.13
0.81
1.07
0.735
Vdc
VIL Low Input Voltage
1.95
1.48
1.95
1.48
1.95
1.45
Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50 W resistor to 2.0 V.
Table 3. AC PARAMETERS
0° 25° 75°
Symbol
Characteristic
Min Max Min Max Min
Max Unit
tpd Propagation Delay
tset Setup Time
thold Hold Time
tr Rise Time
tf Fall Time
ftog Toggle Frequency
trr Reset Recovery Time
(t19+)
0.7 3.0 0.7 3.0 0.7
1.5 1.5 1.5
1.0 1.0 1.0
0.7 2.6 0.7 2.6 0.7
0.7 2.6 0.7 2.6 0.7
250 250 250
3.0 3.0 3.0
3.0 ns
ns
ns
2.6 ns
2.6 ns
MHz
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com
2




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