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NXP Semiconductors |
IP4064CX8; IP4364CX8; www.DataSheet4U.com
IP4366CX8
Integrated SIM card passive filter array with ESD protection to
IEC 61000-4-2 level 4
Rev. 02 — 11 February 2010
Product data sheet
1. Product profile
1.1 General description
The IP4064CX8, IP4364CX8 and IP4366CX8 are 3-channel RC low-pass filter arrays
which are designed to provide filtering of undesired RF signals in the 800 MHz to
3000 MHz frequency band. In addition, the IP4064CX8, IP4364CX8 and IP4366CX8
incorporate diodes to provide protection to downstream components from ElectroStatic
Discharge (ESD) voltages as high as ±15 kV contact discharge according the
IEC 61000-4-2 model, far exceeding standard level 4.
All three devices are fabricated using monolithic silicon technology and integrate
three resistors and seven high-level ESD-protection diodes in a single Wafer-Level
Chip-Scale Package (WLCSP). These features make the IP4064CX8, IP4364CX8 and
IP4366CX8 ideal for use in applications requiring the utmost in miniaturization such as
mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features and benefits
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
3-channel SIM card interface integrated RC filter array
Integrated 100 Ω/100 Ω/47 Ω series channel resistors
Integrated ESD protection withstanding ±15 kV contact discharge, far exceeding
IEC 61000-4-2 level 4
WLCSP with 0.4 mm pitch (IP4364CX8 and IP4366CX8) and 0.5 mm pitch
(IP4064CX8)
1.3 Applications
SIM interfaces in e.g. cellular and Personal Communication System (PCS) mobile
handsets
NXP Semiconductors
IP4064CX8; IP4364CX8; IP4366CX8
www.DataSheet4U.com
Integrated SIM card passive filter array with ESD protection
2. Pinning information
2.1 Pinning
Fig 1. Pin configuration
bump A1
index area
123
A
B
C
008aaa206
transparent top view,
solder balls facing down
2.2 Pin description
Table 1.
Pin
A1
A2
A3
B1
B2
B3
C1
C2
C3
Pinning
Description
not connected (missing ball)
external pin 1
internal pin 1
external pin 2
ground
internal pin 2
external pin 3
supply ESD protection
internal pin 3
3. Ordering information
Table 2. Ordering information
Type number
Package
Name
IP4064CX8/LF/P
WLCSP8
IP4364CX8/LF/P
WLCSP8
IP4366CX8/P
WLCSP8
Description
wafer level chip-size package; 8 bumps; 1.41 × 1.41 × 0.65 mm
wafer level chip-size package; 8 bumps; 1.16 × 1.16 × 0.61 mm
wafer level chip-size package; 8 bumps; 1.16 × 1.16 × 0.61 mm
Version
IP4064CX8/LF/P
IP4364CX8/LF/P
IP4366CX8/P
IP4064CX8_IP4364CX8_IP4366CX8_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 11 February 2010
© NXP B.V. 2010. All rights reserved.
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