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CS8240
500 mA High Side
(PNP) Driver with
On-Chip Flyback Diode
The CS8240 is a fast, PNP high side driver capable of delivering up
to 500 mA into a resistive or inductive load in harsh automotive or
industrial environments. An internal flyback diode clamp is
incorporated for inductive loads. The input (VIN) is TTL and CMOS
compatible and has hysteresis to minimize the effects of noise. When
the input is high, the output is on. When the input is low, the output is
off and the supply voltage quiescent current is very low (< 1.0 µA, typ).
For device protection, the CS8240 incorporates thermal shutdown,
short circuit current limiting, overvoltage shutdown, and reverse
battery protection. The CS8240 can withstand supply voltage
transients of 60 V (min) and –50 V.
The CS8240 is available in an overmolded 5 lead TO–220 package
and is a competitive replacement for the LM–1921, LM–1951,
LM–1952, MC–3399, and L–9350.
Features
• Low Output Saturation Voltage
– 0.22 V at IOUT = 125 mA
– 0.33 V at IOUT = 225 mA
• Overmolded Package
• On–Chip Flyback Diode
• Fault Protection
– Over Voltage Shutdown (32 V, typ)
– Thermal Shutdown (165°C, typ)
– Short Circuit Limiting (1.1 A typ)
– –50 V Reverse Transient Protection
– 60 V Load Dump Protection
– Reverse Battery
• Low Quiescent Current (Off State)
• ESD Protected
VCC
Current
Limit
Overvoltage
Shutdown
Control
Circuit
VIN
Thermal
Shutdown
OUT
GND
Figure 1. Block Diagram
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1
5
TO–220
FIVE LEAD
TQ SUFFIX
CASE 314D
TO–220
FIVE LEAD
TQVA SUFFIX
CASE 314N
Pin 1. VCC
2. OUT
3. NC
4. GND
5. VIN
1
5
MARKING DIAGRAM
CS8240
AWLYWW
1
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
CS8240YTQ5
CS8240YTQVA5
Package
TO–220
FIVE LEAD
STRAIGHT
TO–220
FIVE LEAD
VERTICAL
Shipping
50 Units/Rail
50 Units/Rail
© Semiconductor Components Industries, LLC, 2001
April, 2001 – Rev. 4
1
Publication Order Number:
CS8240/D
CS8240
MAXIMUM RATINGS*
Supply Voltage
Overvoltage Protection
Reverse Voltage:
Internal Power Dissipation
Rating
DC
Transient
Logic Input Voltage
Junction Temperature Range, TJ
Storage Temperature Range, TS
Lead Temperature Soldering:
Wave Solder (through hole styles only) (Note 1)
Electrostatic Discharge (Human Body Model)
1. 10 second maximum.
*The maximum package power dissipation must be observed.
Value
6.0 to 26
60
–16
–50
Internally
limited
–0.3 to +7.0
–40 to150
–55 to +165
260 peak
2.0
Unit
V
V
V
V
–
V
°C
°C
°C
kV
ELECTRICAL CHARACTERISTICS (–40°C ≤ TA ≤ 125°C; –40°C ≤ TJ ≤ 150°C, unless otherwise specified.)
Characteristic
Test Conditions
Min Typ
General Characteristics
Operating Supply Voltage
– 6.0 –
Quiescent Current
Output Stage
VCC = 12V, VIN ≤ VIN(LOW)
VIN ≥⋅VIN(HI), RLOAD = 50 Ω,
6.0 V ≤ VCC ≤ 20 V
20 V ≤ VCC ≤ 24 V
– 1.0
– 16
– 25
Output Saturation Voltage
VIN ≤ VIN(HI), VCC = 6.0 V, ILOAD = 125 mA
VCC = 14 V, ILOAD = 225 mA
–
–
0.22
0.33
Output Leakage Current
Negative Output Clamp
Turn On Delay Time
Turn Off Delay Time
Input Stage
Input ≤ VIN(L), VCC = 12 V, VOUT = 0 V
ICLAMP = 100 mA, VCC = 12 V
VCC = 12 V, ILOAD = 150 mA
VCC = 12 V, ILOAD = 150 mA
– 1.0
–18 –15.5
– 5.0
– 5.0
Input Voltage
Logic = High, VCC = 12 V Turn ON
Logic = Low, VCC = 12 V Turn OFF
0.8 1.45
– 1.2
Input Current
VIN = 5.5 V
VIN = 0.8 V
– 100
– 15
Protection Circuitry
Overvoltage Shutdown
Output Short Circuit Current
Thermal Shutdown
VIN ≥ VIN(HI)
VIN ≥ VIN(HI), VCC = 12 V, VOUT = 0 V
–
26 32
0.55 1.1
150 165
Max
–
100
30
50
0.5
0.7
150
–12
20
20
–
2.0
200
50
–
2.5
–
Unit
V
µA
mA
mA
V
V
µA
V
µs
µs
V
V
µA
µA
V
A
°C
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