SG3644 반도체 회로 부품 판매점
DUAL HIGH SPEED DRIVER
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 Microsemi Corporation |
SG1644/SG2644/SG3644
DUAL HIGH SPEED DRIVER
DESCRIPTION
The SG1644, 2644, 3644 is a dual non-inverting monolithic high
speed driver. This device utilizes high voltage Schottky logic to
convert TTL signals to high speed outputs up to 18V. The totem
pole outputs have 3A peak current capability, which enables them
to drive 1000pF loads in typically less than 25ns. These speeds
make it ideal for driving power MOSFETs and other large capaci-
tive loads requiring high speed switching.
In addition to the standard packages, Silicon General offers the 16
pin S.O.I.C. (DW-package) for commercial and industrial applica-
tions, and the Hermetic TO-66 (R-package) for military use.
These packages offer improved thermal performance for applica-
tions requiring high frequencies and/or high peak currents.
EQUIVALENT CIRCUIT SCHEMATIC
FEATURES
• Totem pole outputs with 3.0A peak current
capability.
• Supply voltage to 22V.
• Rise and fall times less than 25ns.
• Propagation delays less than 20ns.
• Non-inverting high-speed high-voltage Schottky
logic.
• Efficient operation at high frequency.
• Available in:
8 Pin Plastic and Ceramic DIP
14 Pin Ceramic DIP
16 Pin Plastic S.O.I.C.
20 Pin LCC
TO-99
TO-66
HIGH RELIABILITY FEATURES - SG1644
♦ Available to MIL-STD-883
♦ Radiation data available
♦ LMI level "S" processing available
VCC
6.5V
VREG
2.5K
3K 3K
INV. INPUT
OUTPUT
LOGIC
GND
(Substrate)
9/91 Rev 1.2 6/97
Copyright © 1997
POWER
GND
LINFINITY Microelectronics Inc.
11861 Western Avenue ∞ Garden Grove, CA 92841
1 (714) 898-8121 ∞ FAX: (714) 893-2570
SG1644/SG2644/SG3644
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage (VCC) ........................................................... 22V
Logic Input Voltage ............................................................... 7V
Source/Sink Output Current (Each Output)
Continuous ................................................................... ±0.5A
Pulse, 500ns ................................................................ ±3.0A
Operating Junction Temperature
Hermetic (J, T, Y, R-Packages) ....................................150°C
Plastic (M, DW, L-Packages) ...................................... 150°C
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) .................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the
specified terminal.
THERMAL DATA
J Package:
Thermal Resistance-Junction to Case, θJC .................. 30°C/W
Thermal Resistance-Junction to Ambient, θJA ............... 80°C/W
Y Package:
Thermal Resistance-Junction to Case, θJC .................. 50°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 130°C/W
M Package:
Thermal Resistance-Junction to Case, θJC .................. 60°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 95°C/W
DW Package:
Thermal Resistance-Junction to Case, θJC .................. 40°C/W
Thermal Resistance-Junction to Ambient, θJA ............... 95°C/W
T Package:
Thermal Resistance-Junction to Case, θJC .................. 25°C/W
Thermal Resistance-Junction to Ambient, θJA ............ 130°C/W
R Package:
Thermal Resistance-Junction to Case, θJC ................. 5.0°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 40°C/W
L Package:
Thermal Resistance-Junction to Case, θJC .................. 35°C/W
Thermal Resistance-Junction to Ambient, θJA ............ 120°C/W
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers forθJC are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The θJA numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.
RECOMMENDED OPERATING CONDITIONS (Note 2)
Supply Voltage (VCC) .................................. 4.5V to 20V (Note 3)
Frequency Range ............................................... DC to 1.5MHz
Peak Pulse Current ............................................................ ±3A
Logic Input Voltage ................................................. -0.5 to 5.5V
Note 2. Range over which the device is functional.
Note 3. AC performance has been optimized for V = 8V to 20V.
CC
Operating Ambient Temperature Range (TA)
SG1644 ......................................................... -55°C to 125°C
SG2644 ........................................................... -25°C to 85°C
SG3644 ............................................................... 0°C to 70°C
ELECTRICAL CHARACTERISTICS
(Unless
otherwise
specified,
these
specfiications
apply
over
the
operating
ambient
temperatures
for
SG1644
with
-55
°C
≤
T
A
≤
125°C,
SG2644
with
-25°C
≤ TA ≤ 85°C, SG3644 with 0°C ≤ TA ≤ 70°C, and VCC = 20V. Low duty cycle pulse testing techniques are used which maintains junction and case
temperatures equal to the ambient temperature.)
Parameter
Static Characteristics
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input High Current
Input Low Current
Input Clamp Voltage
Output High Voltage (Note 4)
Output Low Voltage (Note 4)
Supply Current Outputs Low
Supply Current Outputs High
Test Conditions
VIN = 2.4V
V = 5.5V
IN
VIN = 0V
IIN = -10mA
I = -200mA
OUT
IOUT = 200mA
VIN = 0V (both inputs)
V = 2.4V (both inputs)
IN
SG1644/2644/3644 Units
Min. Typ. Max.
2.0
V -3
CC
18
7.5
0.7
500
1.0
-4
-1.5
1.0
27
12
V
V
µA
mA
mA
V
V
V
mA
mA
Note 4. V = 10V to 20V.
CC
9/91 Rev 1.2 6/97
Copyright © 1997
LINFINITY Microelectronics Inc.
11861 Western Avenue ∞ Garden Grove, CA 92841
2 (714) 898-8121 ∞ FAX: (714) 893-2570
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( microsemi )
SG3644 driver
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