파트넘버.co.kr SG3626 데이터시트 PDF


SG3626 반도체 회로 부품 판매점

DUAL HIGH SPEED DRIVER



Microsemi Corporation 로고
Microsemi Corporation
SG3626 데이터시트, 핀배열, 회로
SG1626/SG2626/SG3626
DUAL HIGH SPEED DRIVER
DESCRIPTION
The SG1626, 2626, 3626 is a dual inverting monolithic high
speed driver that is pin for pin compatible with the DS0026,
TSC426 and ICL7667. This device utilizes high voltage Schottky
logic to convert TTL signals to high speed outputs up to 18V. The
totem pole outputs have 3A peak current capability, which en-
ables them to drive 1000pF loads in typically less than 25ns.
These speeds make it ideal for driving power MOSFETs and
other large capacitive loads requiring high speed switching.
In addition to the standard packages, Silicon General offers the
16 pin S.O.I.C. (DW-package) for commercial and industrial
applications, and the Hermetic TO-66 (R-package) for military
use. These packages offer improved thermal performance for
applications requiring high frequencies and/or high peak cur-
rents.
FEATURES
Pin for pin compatible with DS0026, TSC426 and
ICL7667.
Totem pole outputs with 3.0A peak current capability.
Supply voltage to 22V.
Rise and fall times less than 25ns.
Propagation delays less than 20ns.
Inverting high-speed high-voltage Schottky logic.
Efficient operation at high frequency.
Available in:
8 Pin Plastic and Ceramic DIP
14 Pin Ceramic DIP
16 Pin Plastic S.O.I.C.
20 Pin LCC
TO-99
TO-66
HIGH RELIABILITY FEATURES - SG1626
Available to MIL-STD-883
Radiation data available
LMI level"S" processing available
EQUIVALENT CIRCUIT SCHEMATIC
V
CC
6.5V
VREG
2.5K
3K
INV. INPUT
OUTPUT
9/91 Rev 1.1 2/94
Copyright © 1994
GND
LINFINITY Microelectronics Inc.
1 11861 Western Avenue Garden Grove, CA 92841
(714) 898-8121 FAX: (714) 893-2570


SG3626 데이터시트, 핀배열, 회로
SG1626/SG2626/SG3626
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage (VCC) ........................................................... 22V
Logic Input Voltage ............................................................... 7V
Source/Sink Output Current (Each Output)
Continuous ................................................................... ±0.5A
Pulse, 500ns ................................................................ ±3.0A
Operating Junction Temperature
Hermetic (J, T, Y, R-Packages) ................................... 150°C
Plastic (M, DW, L-Packages) ....................................... 150°C
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) ................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the
specified terminal.
THERMAL DATA
J Package:
Thermal Resistance-Junction to Case, θJC .................. 30°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 80°C/W
Y Package:
Thermal Resistance-Junction to Case, θJC .................. 50°C/W
Thermal Resistance-Junction to Ambient, θJA ............ 130°C/W
M Package:
Thermal Resistance-Junction to Case, θJC .................. 60°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 95°C/W
DW Package:
Thermal Resistance-Junction to Case, θJC .................. 40°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 95°C/W
T Package:
Thermal Resistance-Junction to Case, θJC .................. 25°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 130°C/W
R Package:
Thermal Resistance-Junction to Case, θJC ................. 5.0°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 40°C/W
L Package:
Thermal Resistance-Junction to Case, θJC .................. 35°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 120°C/W
Note A.
Junction Temperature Calculation:
T
J
=
T
A
+
(P
D
x
θJA).
Note B. The above numbers for θJC are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The θJA numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
RECOMMENDED OPERATING CONDITIONS (Note 2)
Supply Voltage (VCC) .................................. 4.5V to 20V (Note 3)
Frequency Range ............................................... DC to 1.5MHz
Peak Pulse Current ............................................................ ±3A
Logic Input Voltage ................................................ -0.5 to 5.5V
Note 2. Range over which the device is functional.
Note 3. AC performance has been optimized for V = 8V to 20V.
CC
Operating Ambient Temperature Range (TJ)
SG1626 ......................................................... -55°C to 125°C
SG2626 ........................................................... -25°C to 85°C
SG3626 .............................................................. 0°C to 70°C
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1626 with -55°C TA 125°C, SG2626 with -
25°C TA 85°C, SG3626 with 0°C TA 70°C, and VCC = 20V. Low duty cycle pulse testing techniques are used which maintains junction and case
temperatures equal to the ambient temperature.)
Parameter
Static Characteristics
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input High Current
Input Low Current
Input Clamp Voltage
Output High Voltage (Note 4)
Output Low Voltage (Note 4)
Supply Current Outputs Low
Supply Current Outputs High
Note 4. VCC = 10V to 20V.
Test Conditions
V = 2.4V
IN
VIN = 5.5V
VIN = 0V
I = -10mA
IN
IOUT = -200mA
IOUT = 200mA
V = 2.4V (both inputs)
IN
VIN = 0V (both inputs)
SG1626/2626/3626
Min. Typ. Max.
Units
2.0
VCC-3
18
7.5
0.7
500
1.0
-4
-1.5
1.0
27
12
V
V
µA
mA
mA
V
V
V
mA
mA
9/91 Rev 1.1 2/94
Copyright © 1994
LINFINITY Microelectronics Inc.
2 11861 Western Avenue Garden Grove, CA 92841
(714) 898-8121 FAX: (714) 893-2570




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SG3626 driver

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