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Formosa MS |
SMD Zener Diode
BZT55 Series
Formosa MS
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3~4
Rating and characteristic curves........................................................ 5
Pinning information...........................................................................6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities...........................................................9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID Issued Date
DS-221735
2009/08/10
Revised Date
2010/05/10
Revision
C
Page.
9
SMD Zener Diode
BZT55 Series
500mW Surface Mount Zener
Diodes - 2.0V-51V
Features
• Silicon epitaxial planar chip structure.
• Zener Breakdown Voltage Range, 2.4V to 51V ex.BZT55C2V4
• Zener Breakdown Voltage Range, 2.0V to 36V ex.BZT55B2V0
• Small package size for high density applications.
• Ideally suited for automated assembly processes.
• Pb-Free package is available.
• Suffix "-H" indicates Halogen-free parts, ex.BZT55C2V4-H.
Formosa MS
Package outline
SOD-123F
0.110(2.80)
0.098(2.50)
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123F
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.010 gram
0.053(1.35)
0.037(0.95)
0.154(3.90)
0.141(3.60)
Dimensions in inches and (millimeters)
Maximum ratings (at TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward voltage
@IF = 10mA
Total power dissipation
Thermal resistance
at TA=25oC Mounted on FR-5 board, note1
Junction to ambient, note1
Junction to case, note1
Operating junction temperature range
Storage temperature range
Note1.Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad area 25mm2
Symbol MIN.
VF
PD
RθJA
RθJC
TJ
TSTG
-55
-55
TYP.
305
200
MAX.
0.9
500
+150
+150
UNIT
V
mW
OC/W
OC/W
oC
oC
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID Issued Date
DS-221735
2009/08/10
Revised Date Revision
2010/05/10
C
Page.
9
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