파트넘버.co.kr BZT55C30 데이터시트 PDF


BZT55C30 반도체 회로 부품 판매점

SMD Zener Diode



Formosa MS 로고
Formosa MS
BZT55C30 데이터시트, 핀배열, 회로
SMD Zener Diode
BZT55 Series
Formosa MS
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3~4
Rating and characteristic curves........................................................ 5
Pinning information...........................................................................6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities...........................................................9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID Issued Date
DS-221735
2009/08/10
Revised Date
2010/05/10
Revision
C
Page.
9


BZT55C30 데이터시트, 핀배열, 회로
SMD Zener Diode
BZT55 Series
500mW Surface Mount Zener
Diodes - 2.0V-51V
Features
Silicon epitaxial planar chip structure.
Zener Breakdown Voltage Range, 2.4V to 51V ex.BZT55C2V4
Zener Breakdown Voltage Range, 2.0V to 36V ex.BZT55B2V0
Small package size for high density applications.
Ideally suited for automated assembly processes.
Pb-Free package is available.
Suffix "-H" indicates Halogen-free parts, ex.BZT55C2V4-H.
Formosa MS
Package outline
SOD-123F
0.110(2.80)
0.098(2.50)
Mechanical data
Epoxy : UL94-V0 rated flame retardant
Case : Molded plastic, SOD-123F
Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : Approximated 0.010 gram
0.053(1.35)
0.037(0.95)
0.154(3.90)
0.141(3.60)
Dimensions in inches and (millimeters)
Maximum ratings (at TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward voltage
@IF = 10mA
Total power dissipation
Thermal resistance
at TA=25oC Mounted on FR-5 board, note1
Junction to ambient, note1
Junction to case, note1
Operating junction temperature range
Storage temperature range
Note1.Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad area 25mm2
Symbol MIN.
VF
PD
RθJA
RθJC
TJ
TSTG
-55
-55
TYP.
305
200
MAX.
0.9
500
+150
+150
UNIT
V
mW
OC/W
OC/W
oC
oC
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID Issued Date
DS-221735
2009/08/10
Revised Date Revision
2010/05/10
C
Page.
9




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BZT55C30 diode

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