APT30DF20HJ 반도체 회로 부품 판매점
Fast Diode Full Bridge Power Module
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 Microsemi |
APT30DF20HJ
ISOTOP®Fast Diode
Full Bridge Power Module
VRRM = 200V
IF = 30A @ Tc = 80°C
+~
~-
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Application
• Switch mode power supplies rectifier
• Induction heating
• Welding equipment
• High speed rectifiers
Features
• Ultra fast recovery times
• Soft recovery characteristics
• High blocking voltage
• High current
• Low leakage current
• Very low stray inductance
• High level of integration
• ISOTOP® Package (SOT-227)
Benefits
• Outstanding performance at high frequency operation
• Low losses
• Low noise switching
• Direct mounting to heatsink (isolated package)
• Low junction to case thermal resistance
• RoHS Compliant
Absolute maximum ratings
Symbol
Parameter
VR Maximum DC reverse Voltage
VRRM Maximum Peak Repetitive Reverse Voltage
IF(AV)
Maximum Average Forward
Current
Duty cycle = 50%
IFSM Non-Repetitive Forward Surge Current
8.3ms
TC = 25°C
TC = 80°C
TJ = 45°C
Max ratings
200
45
30
320
Unit
V
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1-4
APT30DF20HJ
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
VF Diode Forward Voltage
IRM Maximum Reverse Leakage Current
CT Junction Capacitance
Test Conditions
Min Typ Max Unit
IF = 30A
IF = 60A
1.1 1.3
1.4
V
IF = 30A
Tj = 125°C
0.9
VR = 200V
Tj = 25°C
Tj = 125°C
250 µA
500
VR = 200V
95 pF
Dynamic Characteristics
Symbol Characteristic
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
IRRM Reverse Recovery Current
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
IRRM Reverse Recovery Current
Test Conditions
Min Typ Max Unit
IF = 30A
VR = 133V
di/dt = 200A/µs
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
IF = 30A
VR = 133V Tj = 125°C
di/dt=1000A/µs
24
48
33
150
3
6
31
355
19
ns
nC
A
ns
nC
A
www.DaTtahSehreemt4aUl.caomnd package characteristics
Symbol Characteristic
RthJC
RthJA
VISOL
TJ,TSTG
TL
Torque
Junction to Case Thermal resistance
Junction to Ambient
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Storage Temperature Range
Max Lead Temp for Soldering:0.063” from case for 10 sec
Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
Wt Package Weight
Min Typ
2500
-55
29.2
Max Unit
1.2 °C/W
20
V
150
300
°C
1.5 N.m
g
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( microsemi )
APT30DF20HJ diode
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