LT1ZE40A 반도체 회로 부품 판매점
DEVICE SPECIFICATION FOR . Light Emitting Diode
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 Sharp Electrionic Components |
PREPARED BY:
DATE:
A-
t SPEC.No:
DG-996011
APPROVED BY:
Jd
DATE:
ELECTRONIC COMPONENTS GROUP
B /‘YY
SHARP CORPORATION
( SPECIFICATION
REPRESENTATIVE DIVISION:
1 Opto-Electronic Devices Division
/
DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
LTlZE4OA
Y
.
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp5 consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting corn use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
I * Tooling machines * Computers
1
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers l Rescue and security equipment
1L * Other safety equipment
(3) Please do not use this product for equipment which require extremely high reliability
and safety in fimction and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
c l Nuclear power control equipment * Medical equipment
1
. (4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
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CUSTOMER’S APPROVAL
DATE:
BY:
DATE:
PRESENTED BY:
M.Katoh,
I
Department General Manager of
Engineering Dept.,111
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
J .i
L.
.DG-g96011.-.
i __,
MODEL Nd. ‘-
_.
LTl ZE40A
. Feb/22/9!
- PAGE -
l/14
LTlZE40A Smdkation
1. Application
This specification applies to the light emitting diode device Model No. LTl ZE4OA.
[AlInGaP (dicing or scribe/brake type/Yellow green) chip LED device]
2. Outline dimensions and temkal connections ...*.*..**...~.......,~f~
to the attached sheet Page2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-5.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attached sheet Page 6.
4-1. Test items and test conditions
4-2. Failure judgement criteria
5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7.
5- 1. Inspection method
5-2. Description of inspection and criteria
6. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attached sheet Page 8- 11.
6-1. Taping
6-2. Label
6-3. Luminous intensity rank
6-4. Dominant wavelength raak
7. Packing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Refer to the attached sheet Page 12.
7- 1. Dampproof package
7-2. Storage conditions
7-3. Treatment after opening
8. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 13.
8- 1. Reflow soldering
8-2. Manual soldering
9. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 14.
9- 1. Precautions matters for designing circuit
9-2. Cleaning method
10. Ekironment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 14.
lo- 1. Ozonosphere destructive chemicals.
10-2. Bromic non-burning materials
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제조업체: Sharp Electrionic Components
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LT1ZE40A diode
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[ LT1ZE40A.PDF ]
[ LT1ZE40A 다른 제조사 검색 ]
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