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GigaDevice |
GigaDevice Semiconductor Inc.
GD32F103xx
ARM® Cortex™-M3 32-bit MCU
Datasheet
Table of Contents
GD32F103xx
List of Figures............................................................................................................................. 3
List of Tables............................................................................................................................... 4
1 General description ......................................................................................................... 5
2 Device overview ............................................................................................................... 6
2.1 Device information ..............................................................................................................................6
2.2 Block diagram......................................................................................................................................9
2.3 Pinouts and pin assignment ............................................................................................................11
2.4 Memory map......................................................................................................................................15
2.5 Clock tree ...........................................................................................................................................16
2.6 Pin definitions ....................................................................................................................................17
3 Functional description .................................................................................................. 25
3.1 ARM® Cortex™-M3 core..................................................................................................................25
3.2 On-chip memory................................................................................................................................25
3.3 Clock, reset and supply management ...........................................................................................26
3.4 Boot modes........................................................................................................................................26
3.5 Power saving modes ........................................................................................................................27
3.6 Analog to digital converter (ADC) ...................................................................................................27
3.7 Digital to analog converter (DAC)...................................................................................................28
3.8 DMA ....................................................................................................................................................28
3.9 General-purpose inputs/outputs (GPIOs)......................................................................................28
3.10 Timers and PWM generation...........................................................................................................29
3.11 Real time clock (RTC) ......................................................................................................................30
3.12 Inter-integrated circuit (I2C).............................................................................................................30
3.13 Serial peripheral interface (SPI)......................................................................................................31
3.14 Universal synchronous asynchronous receiver transmitter (USART).......................................31
3.15 Inter-IC sound (I2S) ..........................................................................................................................31
3.16 Secure digital input and output card interface (SDIO).................................................................32
3.17 Universal serial bus full-speed (USB 2.0 FS) ...............................................................................32
3.18 Controller area network (CAN)........................................................................................................32
3.19 External memory controller (EXMC) ..............................................................................................32
3.20 Debug mode ......................................................................................................................................33
3.21 Package and operation temperature..............................................................................................33
4 Electrical characteristics .............................................................................................. 34
4.1 Absolute maximum ratings ..............................................................................................................34
4.2 Recommended DC characteristics.................................................................................................34
4.3 Power consumption ..........................................................................................................................35
4.4 EMC characteristics..........................................................................................................................36
4.5 Power supply supervisor characteristics .......................................................................................36
4.6 Electrical sensitivity...........................................................................................................................37
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