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OKI electronic componets |
E2H0093-15-90
¡¡SemicondSucetormiconductor
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MSC23409C/CL-xxDS9
4,194,304-Word ¥ 9-Bit DRAM MODULE : FAST PAGE MODE TYPE
DESCRIPTION
The OKI MSC23409C/CL-xxDS9 is a fully decoded 4,194,304-word ¥ 9-bit CMOS Dynamic
Random Access Memory Module composed of nine 4-Mb DRAMs (4M ¥ 1) in SOJ packages
mounted with nine decoupling capacitors on a 30-pin glass epoxy single-inline package. This
module is generally used for memory expansion in parity applications such as workstations. The
low-power version (CL) offers reduced power consumption for mobile computing applications
like laptops and palmtops.
FEATURES
• 4-Meg ¥ 9-bit organization
• 30-Pin Socket Insertable Module
MSC23409C/CL-xxDS9 : Solder tab
• Single 5 V supply ±10% tolerance
• Access times : 60, 70, 80 ns
• Input : TTL compatible
• Output : TTL compatible, 3-state
• Refresh : 1024 cycles/16 ms (128 ms : L-version)
• CAS before RAS refresh, CAS before RAS hidden refresh, RAS-only refresh capability
• Multi-bit test mode capability
• Fast Page Mode capability
PRODUCT FAMILY
Family
MSC23409C/CL-60DS9
MSC23409C/CL-70DS9
MSC23409C/CL-80DS9
Access Time (Max.)
tRAC
60 ns
tAA
30 ns
tCAC
15 ns
70 ns 35 ns 20 ns
80 ns 40 ns 20 ns
Cycle Time
Power Dissipation
(Min.) Operating (Max.) Standby (Max.)
110 ns
130 ns
150 ns
4950 mW
4455 mW
3960 mW
49.5 mW/
9.9 mW (L-version)
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¡ Semiconductor
MSC23409C/CL-xxDS9
PIN CONFIGURATION
MSC23409C/CL-xxDS9
3.38 Tpy.
*1
88.9 ±0.2
82.14 Typ.
f 3.18
20.45 Max.
Typ.
10.16
Typ.
6.35
2.03 Typ.
1
5.59 Typ.
2.54 ±0.1
73.66
30
1.78 Typ.
5.28 Max.
2.54 Min.
1.27
+0.1
–0.08
*1 The common size difference of the board width 12.5 mm of its height is
specified as ±0.2. The value above 12.5 mm is specified as ±0.5.
Pin No.
1
2
3
4
5
6
7
8
9
10
Pin Name
VCC
CAS
DQ0
A0
A1
DQ1
A2
A3
VSS
DQ2
Pin No.
11
12
13
14
15
16
17
18
19
20
Pin Name
A4
A5
DQ3
A6
A7
DQ4
A8
A9
A10
DQ5
Pin No.
21
22
23
24
25
26
27
28
29
30
Pin Name
WE
VSS
DQ6
NC
DQ7
Q8
RAS
CAS8
D8
VCC
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