EP3C25 반도체 회로 부품 판매점
Cyclone Series Device Thermal Resistance
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 Altera Corporation |
May 2008, version 3.0
Cyclone Series Device
Thermal Resistance
Data Sheet
Revision
History
The following table shows the revision history for this data sheet.
Date
May 2008
July 2007
May 2007
March 2007
April 2006
Document Version
Changes Made
3.0 Updated Tables 2, 4, and 5.
2.2 Updated values for EP3C25 (E144) device in Table 2.
2.1 Updated values for EP3C10 (E144) device in Table 2 and added
Revision History.
2.0 Added Cyclone III information.
1.0 Initial release.
f
Tables 1 through 6 in this data sheet provide θ JA (junction-to-ambient
thermal resistance) and θ JC (junction-to-case thermal resistance) values
for Altera® Cyclone® series devices available in Ball-Grid Array (BGA),
FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine
BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),
Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),
Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).
For additional packaging information, refer to the Altera Device Packaging
Data Sheet.
Altera Corporation
DS-CYTHRML-3.0
www.DataSheet.in
1
Cyclone III
Devices
Altera Device Package Information Data Sheet
Thermal resistance values for Cyclone III devices are provided for a board
meeting JEDEC specifications and for a typical board. The JEDEC board
specifications require two signals and two power/ground planes and are
available at www.jedec.org. The values are described in Tables 1
through 4.
Table 1. Thermal Resistance Values for Cyclone III Devices
Value
θJA (C/W) Still Air
θJA (C/W) 100 ft./minute
θJA (C/W) 200 ft./minute
θJA (C/W) 400 ft./minute
θJC (C/W)
θJB (C/W)
Description
Junction-to-ambient thermal resistance (θJA) with no airflow when a heat sink
is not being used.
Junction-to-ambient thermal resistance with 100 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 200 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 400 ft./minute airflow when a
heat sink is not being used.
Junction-to-case thermal resistance (θJC) for device.
Junction-to-board thermal resistance (θJB) for specific board being used.
Table 2 provides θJA (junction-to-ambient thermal resistance) values and
θJC (junction-to-case thermal resistance) values for Cyclone III devices on
a board meeting JEDEC specifications for thermal resistance calculation.
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2)
Device
EP3C5
EP3C10
Package
E144
F256
U256
M164
E144
F256
U256
M164
θJA (°C/W)
Still Air
20
32.4
32.5
38.2
20
32.4
32.5
38.2
θJA (°C/W)
100 ft./min.
17.5
28.9
29.1
31.5
17.5
28.9
29.1
31.5
θJA (°C/W)
200 ft./min.
15.4
27
27.2
29.6
15.4
27
27.2
29.6
θJA (°C/W)
400 ft./min.
14
25.5
25.6
27.9
14
25.5
25.6
27.9
θJC (°C/W)
8.4
11.7
12.2
11.6
8.4
11.7
12.2
11.6
2
www.DataSheet.in
DS-CYTHRML-3.0
Altera Corporation
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관련 데이터시트
EP3C25
(EP3C25 / EP3C120) Cyclone III FPGA Family - Altera
EP3C25
Cyclone Series Device Thermal Resistance - Altera Corporation