ADL5380 반도체 회로 부품 판매점
400 MHz to 6 GHz Quadrature Demodulator
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 Analog Devices |
FEATURES
Operating RF and LO frequency: 400 MHz to 6 GHz
Input IP3
30 dBm @ 900 MHz
28 dBm @1900 MHz
Input IP2: >65 dBm @ 900 MHz
Input P1dB (IP1dB): 11.6 dBm @ 900 MHz
Noise figure (NF)
10.9 dB @ 900 MHz
11.7 dB @ 1900 MHz
Voltage conversion gain: ~7 dB
Quadrature demodulation accuracy @ 900 MHz
Phase accuracy: ~0.2°
Amplitude balance: ~0.07 dB
Demodulation bandwidth: ~390 MHz
Baseband I/Q drive: 2 V p-p into 200 Ω
Single 5 V supply
APPLICATIONS
Cellular W-CDMA/GSM/LTE
Microwave point-to-(multi)point radios
Broadband wireless and WiMAX
GENERAL DESCRIPTION
The ADL5380 is a broadband quadrature I-Q demodulator that
covers an RF/IF input frequency range from 400 MHz to 6 GHz.
www.DaWtaitShhaeeNt4FU=.c1o0m.9 dB, IP1dB = 11.6 dBm, and IIP3 = 29.7 dBm @
900 MHz, the ADL5380 demodulator offers outstanding dynamic
range suitable for the demanding infrastructure direct-conversion
requirements. The differential RF inputs provide a well-behaved
broadband input impedance of 50 Ω and are best driven from a
1:1 balun for optimum performance.
Excellent demodulation accuracy is achieved with amplitude
and phase balances of ~0.07 dB and ~0.2°, respectively. The
demodulated in-phase (I) and quadrature (Q) differential outputs
are fully buffered and provide a voltage conversion gain of ~7 dB.
The buffered baseband outputs are capable of driving a 2 V p-p
differential signal into 200 Ω.
400 MHz to 6 GHz
Quadrature Demodulator
ADL5380
FUNCTIONAL BLOCK DIAGRAM
ENBL ADJ
BIAS
ADL5380
IHI
RFIN
RFIP
V2I
QUADRATURE
PHASE SPLITTER
ILO
LOIP
LOIN
QHI
Figure 1.
QLO
The fully balanced design minimizes effects from second-order
distortion. The leakage from the LO port to the RF port is
<−50 dBm. Differential dc offsets at the I and Q outputs are
typically <20 mV. Both of these factors contribute to the
excellent IIP2 specification, which is >65 dBm.
The ADL5380 operates off a single 4.75 V to 5.25 V supply. The
supply current is adjustable by placing an external resistor from
the ADJ pin to either the positive supply, VS, (to increase supply
current and improve IIP3) or to ground (which decreases supply
current at the expense of IIP3).
The ADL5380 is fabricated using the Analog Devices, Inc.,
advanced silicon-germanium bipolar process and is available
in a 24-lead exposed paddle LFCSP.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.
ADL5380
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
Low Band Operation.................................................................... 7
Midband Operation ................................................................... 11
High Band Operation ................................................................ 14
Distributions for fLO = 900 MHz............................................... 17
Distributions for fLO = 1900 MHz............................................. 18
Distributions for fLO = 2700 MHz............................................. 19
Distributions for fLO = 3600 MHz............................................. 20
Distributions for fLO = 5800 MHz............................................. 21
Circuit Description......................................................................... 22
LO Interface................................................................................. 22
REVISION HISTORY
7/09—Revision 0: Initial Version
www.DataSheet4U.com
V-to-I Converter......................................................................... 22
Mixers .......................................................................................... 22
Emitter Follower Buffers ........................................................... 22
Bias Circuit.................................................................................. 22
Applications Information .............................................................. 23
Basic Connections...................................................................... 23
Power Supply............................................................................... 23
Local Oscillator (LO) Input ...................................................... 23
RF Input....................................................................................... 24
Baseband Outputs ...................................................................... 24
Error Vector Magnitude (EVM) Performance........................... 24
Low IF Image Rejection............................................................. 25
Example Baseband Interface..................................................... 26
Characterization Setups................................................................. 30
Evaluation Board ............................................................................ 32
Thermal Grounding and Evaluation Board Layout............... 34
Outline Dimensions ....................................................................... 35
Ordering Guide .......................................................................... 35
Rev. 0 | Page 2 of 36
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