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ROHM Semiconductor |
Diodes
RSB12Z
Low Capacitance Protection Device
RSB12Z
zApplication
ESD Protection
www.DataSheet4U.com
zFeatures
1) Ultra small mold type. (VMD3)
2) Low capacitance
3) Bi direction
zConstruction
Silicon Epitaxial Planar
zDimensions (Unit : mm)
zLand size figure (Unit : mm)
0.4
1.2±0.1
0.32±0.05
(3)
0.22±0.05
(1) (2)
0.22±0.05
0.4 0.4
0.13±0.05
0~0.1
0.5±0.05
0.4
0.5
VMD3
0.8
zStructure
ROHM : VMD3
dot(year week factory)
zTaping specifications (Unit : mm)
4.0±0.07
2.0±0.04
φ1.55±0.05
0.3±0.1
1.3±0.05
0
(4.0±0.1)
2.0±0.05
φ0.5±0.05
0.6±0.05
0
zAbsolute maximum ratings (Ta=25°C)
Parameter
Power dissipation
Junction temperature
Storage temperature
Symbol
P
Tj
Tstg
Limits
150
150
-55 to +150
Unit
mW
℃
℃
zElectrical characteristics (Ta=25°C)
Parameter
Zener voltage
Reverse current
Capacitance between terminals
Symbol
VZ
IR
Ct
Min.
9.6
-
-
Typ. Max.
- 14.4
- 0.10
1-
Unit Conditions
V IZ=5mA
µA VR=9V
pF f=1MHz,VR=0V
1/2
Diodes
RSB12Z
zElectrical characteristics curve
www.DataSheet4U.com
10
1
0.1
0.01
0.001
11
Ta=25℃
Ta=-25℃
Ta=75℃
Ta=125℃
Ta=150℃
12 13 14 15
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS
16
10000
1000
100
10
1
0.1
0.01
0.001
0.0001
0
Ta=150℃ Ta=125℃
Ta=75℃
Ta=25℃
Ta=-25℃
12345678
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS
9
13.8 10
Ta=25℃
IZ=5mA
9
Ta=25℃
VR=9V
13.7
n=30pcs
8
n=30pcs
7
13.6 6
5
13.5 4
AVE:13.572V
13.4
13.3
3
2 AVE:0.3089nA
1
0
Vz DISPERSION MAP
IR DISPERSION MAP
10
f=1MHz
1
0.1
0123456789
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
1.5
1.4
Ta=25℃
f=1MHz
1.3 VR=0V
1.2 n=10pcs
1.1
1
0.9 AVE:0.996pF
0.8
0.7
0.6
0.5
Ct DISPERSION MAP
100
10
1
0.1 1
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS
10000
Mounted on epoxy board
IM=1mA
IF=10mA
1000
1ms time
300us
Rth(j-a)
ガラスエポキシ基板実装時
IM=10mA
IF=100mA
100 Rth(j-c)
1ms time
300us
10
10 0.001 0.01 0.1 1 10 100 1000
TIME:t(s)
Rth-t CHARACTERISTICS
2/2
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