BR1111C 반도체 회로 부품 판매점
LED Lamps
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 Stanley Electric |
www.DataSheet4U.com
Product Guide
1111C Series Ultra Compact SMT LED
s Features
• Meets industry standards for 1608 (0603) footprint
• Provides bright, wide and uniform spatial distribution
• Excellent for cellular telephone key pads,
• LCD backlighting and pager display application.
s Applications
• Mobile devices (cellular telephones, PDAs, pagers)
• Industrial / Medical instrumentation
s Outline Dimensions
Unit: mm
Tolerances + 0.1
Epoxy PCB
PCB Warpage direction
s Electro-Optical Characteristics
(Ta=25°C)
Type No. Material Emitted
Color
Lens
Color
BR1111C
AA1111C
AY1111C
PY1111C
PG1111C
BG1111C
GaAIAs
Red
GaAsP
Orange
GaAsP
Yellow
GaP
Yellow Green
GaP
Green
GaP
Pure Green
Units
Milky
White
Luminous
Intensity IV
MIN.
TYP.
IF
7.0 11.7 20
Wavelength
Peak
λp
TYP.
Spectral Line
Dominant Half Width
λd ∆λ
TYP.
TYP.
IF
660 647 30 20
Forward
Voltage VF
TYP MAX.
IF
1.7 2.3 20
Reverse Viewing
Current IR Angle
(2 θ 1/2)
MAX. VR
100 4 140°
2.0 3.4 20 605 606 30 20 2.2 2.8 20 100 4
2.0 3.4 20 580 590 30 20 2.2 2.8 20 100 4
7.0 11.7 20 570 572 30 20 2.1 2.8 20 100 4 150°
3.8 6.4 20 560 567 30 20 2.1 2.8 20 100 4
1.4 2.4 20 555 558 30 20 2.1 2.8 20 100 4
mcd mA
nm
mA V mA µA V Deg.
www.DataSheet4U.com
s Absolute Maximum Ratings
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
IF
IFM
VR
Topr
Tstg
∆IF
Red
BR
57.5
25
60
4
Orange
AA
70
25
60
4
Yellow
Yellow
Green
AY PY
70 70
25 25
60 60
44
-30 to +85
-40 to +100
0.36 (DC) 0.86 (Pulse)
Green
PG
70
25
60
4
Pure
Green
PY
(Ta=25°C)
Units
70 mW
25 mA
60 mA
4V
°C
°C
mA/°C
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
s Operation Current Derating Chart (DC)
BR, AA, AY, PY, PG, BG
s Taping Specifications
φ
1.5
+0.1
0
4+0.1
(1)
(φ 0.5)
Center Hole
2+0.05
4+0.1
(0.2)
Center Hole
Direction to pull
(0.9)
Quantity on tape:
4000 pieces
per reel
φ 21+0.8
2+0.5
φ 13+0.2
s Spatial Distribution
11.4+1
9+0.3
φ 180+30
s Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
Temperature
Pre-heating rise: 5°C/sec.
120
Cooling:
—5°C/sec.
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PG1111C-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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