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EDI |
BRUS1 BRUS5
MINIBRIDGE
50 ns. ULTRA-FAST RECOVERY
4 to 6 AMPERES
SINGLE-PHASE, FULL-WAVE BRIDGES
HEAT SINK CHASSIS PC BOARD MOUNTING
4A3AHEPACBTRMSUOINSTUhK1piNrsoMTmgrOIaaNrmUkGNionTfdUIicNnadGteesrwrericteorgsnLitaiob5noAruantPodreCier sthB, eiOnccAo. mRpDBoRnMeUOnStU5NTING
6A HEAT SINK MOUNTING
PRV/LEG
50V
100V
200V
400V
500V
600V
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BRUS1 SERIES BRUS105
BRUS5 SERIES BRUS505
BRUS110
BRUS510
BRUS120
BRUS520
BRUS140
BRUS540
BRUS150
BRUS550
BRUS160
BRUS560
ELECTRICAL CHARACTERISTICS PER LEG
(at TA=25 C U nle ss O the rwis e Sp eci fie d)
Average Output Current, lo @ 60 CO Tc (Fig.1)
Average Output Current, lo @ 80 CO TL (Fig.2)
Max. Forward Voltage Drop,
IF
BRUS1
BRUS5
Series
Series
=
=
2A
4A
Max.DC Reverse Current @ PRV and 25 C , IR
SERIES DESIGNATION
BRUS1
BRUS5
46
35
1.3 1.3
10 10
Max.DC Reverse Current @ PRV and 100 C ,IR
200 200
Max.Reverse Recovery Time,Trr (Fig.3)
50 50
UNITS
Amps
Amps
Volts
A
A
Nanosec.
Max.Peak Surge Current, lFSM (8.3ms) (Fig.2)
Storage Temperature Range, TSTG
Ambient Operating Temperature Range,TA
Thermal Resistance (Total Bridge), R0- j-c
100 240
-55 to+150
-55 to+150
7.7 typ.
8.7 typ.
Amps
oC
oC
oC/W
NOTE: A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
EDI reserves the right to change these specifications at any time without notice.
FIG.1
CURRENT DERATING
6
BRUS5
5
4
BRUS1
3
2
1
BRUS1 BRUS5
FIG.2
NON-REPETITIVE SURGE CURRENT
1000
500
300
200
100 BRUS5
50
30
20 BRUS1
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0
0 25 50 75 100
Tc =TEMPERATURE (OC)
125 150
10
12
5 10 20
50 100
NUMBER OF CYCLES AT 60 CPS
FIG.3
REVERSE RECOVERY TEST METHOD
T RR
0.5A
1.0A
ZERO
REFERENCE
0.25A
R1
50 OHM
D.U.T.
- R2 SCOPE
1 OHM
PULSE
GENERATOR
R1,R2 NON-INDUCTIVE RESISTORS
PULSE GENERATOR - HEWLETT
PACKARD 214A OR EQUIV.
IKC REP.RATE, 10 SEC. PULSE WIDTH
ADJUST PULSE AMPLITUDE FOR PEAK IR
BRUS MECHANICAL OUTLINE
BRUS5 MECHANICAL OUTLINE
Dielectric test voltage 2,500 V rms.,max. 50-60Hz
+ A AC
B
A
AC C _
D .935 .280
.895
.160
.185
.260
.165
.140
45
E .085
.700
.065
.660
.760Max.
.075R.Typ.
(2 Places)
F
.455
.405
LTR INCHES
A .411-.441
B .137-.167DIA
C .590-.610
D .038-.042
E .750MIN
F .300MAX
MILLIMETERS
10.44-11.20
3.48-4.24DIA
14.99-15.49
.97-1.07
19.05MIN
7.62MAX
1.0Min.
.220
.180
.260
.205
.180
.185
.052
.048
Maximum lead and terminal temperature for soldering, 3/8 inch from case, 5 seconds at 250 C.
A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 * FAX 914-965-5531 * 1-800-678-0828
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