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Semiconductor
MSC23232D/DL-xxBS16/DS16
2,097,152-word x 32-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE
This version: Mar. 3. 1999
DESCRIPTION
The MSC23232D/DL-xxBS16/DS16 is a fully decoded, 2,097,152-word x 32-bit CMOS dynamic random access
memory module composed of sixteen 4Mb DRAMs in SOJ packages mounted with sixteen decoupling capacitors
on a 72-pin glass epoxy single-inline package. This module supports any application where high density and large
capacity of storage memory are required. The MSC23232DL (the low-power version) is specially designed for
lower-power applications.
FEATURES
· 2,097,152-word x 32-bit organization
· 72-pin Single Inline Memory Module
MSC23232D/DL-xxBS16 : Gold tab
MSC23232D/DL-xxDS16 : Solder tab
· Single +5V supply ± 10% tolerance
· Input : TTL compatible
· Output : TTL compatible, 3-state
· Refresh : 1024cycles/16ms (1024cycles/128ms: L-version)
· /CAS before /RAS refresh, hidden refresh, /RAS only refresh capability
· Fast page mode capability
· Multi-bit test mode capability
PRODUCT FAMILY
Family
MSC23232D/DL-60BS16/DS16
MSC23232D/DL-70BS16/DS16
Access Time (Max.)
tRAC
60ns
70ns
tAA
30ns
35ns
tCAC
15ns
20ns
Cycle
Time
(Min.)
110ns
130ns
Power Dissipation
Operating (Max.)
4180mW
3740mW
Standby (Max.)
88mW/
17.6mW (L-version)
Semiconductor
MODULE OUTLINE
MSC23232D/DL-xxBS16/DS16
3.38Typ.
3.18
25.4±0.2
107.95±0.2*1
101.19Typ.
MSC23232D/DL
(Unit : mm)
9.3Max.
Typ. Typ.
10.16 6.35
2.03Typ.
6.35Typ.
1
1.27±0.1
R1.57
6.35
95.25
1.04Typ.
72 3.7Min.
+0.1
1.27 -0.08
*1 The common size difference of the board width 12.5mm of its height is specified as ±0.2.
The value above 12.5mm is specified as ±0.5.
6.2Min.
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