파트넘버.co.kr MD2202 데이터시트 PDF


MD2202 반도체 회로 부품 판매점

(MD2200 - MD2203) Flash Memory



M-Systems Corporation 로고
M-Systems Corporation
MD2202 데이터시트, 핀배열, 회로
Data Sheet
April 2002
DiskOnChip2000 DIP
MD2200/2/3
Features
ƒ Single-chip plug-n-play flash disk
ƒ Low power, single 3.3V or 5V power
supply
ƒ 16Mbyte (MB) to 1GByte (GB) capacity
ƒ Pinout and structure compatible with
DiskOnChip Millennium DIP 8MB
ƒ Simple, easy-to-integrate interface
ƒ 32-pin DIP, JEDEC standard,
EEPROM-compatible pinout
ƒ 8KB sized memory window
ƒ Boot OS capability
ƒ Embedded TrueFFSsoftware provides:
Full hard disk read/write emulation
Third-generation wear leveling
Automatic block management
ƒ Operates with DiskOnChip SDK in
OS-less environments, ANSI-C source
w code kit
w ƒ Error Detection and Correction
w (EDC/ECC) for higher data reliability
.Dƒ Low power consumption – Static
Operation
atƒ Broad OS support: DOS, Windows
aNT4.0/5.0, Windows CE, BE, pSOS+,
SQNX, VxWorks, and others
hƒ Compatible with major processors: x86,
eMediaGX, Geode SCxxxx, PowerPC, 68K,
eMIPS, SHx, StrongARM, and others
t4U.com91-SR-002-42-8L Rev. 3.5
Applications
ƒ Embedded systems
ƒ Internet access devices
ƒ Internet set-top boxes/ITV, Web browsers
ƒ WBT, thin clients, network computers
ƒ Routers, networking
ƒ Web phones, car PCs, DVD, HPC
ƒ Point of sale, industrial PCs
ƒ Telecom, medical
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MD2202 데이터시트, 핀배열, 회로
DiskOnChip 2000 DIP
Table of Contents
1 General Description ................................................................................................................... 4
2 Detailed Feature List.................................................................................................................. 5
2.1 TrueFFS Technology ............................................................................................................ 5
2.2 Low Power Consumption .....................................................................................................................5
2.3 Temperature Range .............................................................................................................................5
2.4 Easy to Integrate ..................................................................................................................................6
2.5 Robust Error Correction .......................................................................................................................6
2.6 High Reliability......................................................................................................................................6
2.7 High Speed ...........................................................................................................................................6
2.8 Compatibility with 8MB DiskOnChip Millennium Series .......................................................................6
2.9 Broad Support for Operating Systems and Processors .......................................................................6
2.10 Portable Solution – Shorter Time to Market .........................................................................................7
2.11 Complete Solution ................................................................................................................................7
3 Package Description and Pin List ............................................................................................ 8
4 Designing with the DiskOnChip 2000 Flash Disk.................................................................... 9
4.1 Hardware .............................................................................................................................. 9
4.2 Software................................................................................................................................ 9
4.3 Media Contents..................................................................................................................... 9
4.4 Designing DiskOnChip 2000 into PC Architecture................................................................ 9
5 Theory of Operation ................................................................................................................. 11
6 Specifications........................................................................................................................... 12
6.1 Absolute Maximum Ratings ................................................................................................ 12
6.2 Capacitance........................................................................................................................ 12
6.3 Temperature Ranges.......................................................................................................... 12
6.4 DiskOnChip Assembly ........................................................................................................ 12
6.5 Humidity.............................................................................................................................. 12
6.6 EDC/ECC............................................................................................................................ 12
6.7 DC Electrical Characteristics over Operating Range.......................................................... 13
6.7.1 Vcc = 5V Characteristics ...........................................................................................................13
6.7.2 Vcc = 3.3V Characteristics ........................................................................................................14
6.8 AC Operating Conditions .................................................................................................... 14
6.9 Timing Specifications.......................................................................................................... 15
6.9.1 Read Cycle Timing ....................................................................................................................15
6.9.2 Write Cycle Timing ....................................................................................................................16
91-SR-002-42-8L Rev. 3.5
2




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