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Philipss |
Philips Semiconductors Linear Products
Dual and single low noise op amp
Product specification
NE5533/5533A/
NE/SA/SE5534/5534A
DESCRIPTION
The 5533/5534 are dual and single high-performance low noise
operational amplifiers. Compared to other operational amplifiers,
such as TL083, they show better noise performance, improved
output drive capability and considerably higher small-signal and
power bandwidths.
This makes the devices especially suitable for application in high
quality and professional audio equipment, in instrumentation and
control circuits and telephone channel amplifiers. The op amps are
internally compensated for gain equal to, or higher than, three. The
frequency response can be optimized with an external
compensation capacitor for various applications (unity gain amplifier,
capacitive load, slew rate, low overshoot, etc.) If very low noise is of
prime importance, it is recommended that the 5533A/5534A version
be used which has guaranteed noise specifications.
FEATURES
• Small-signal bandwidth: 10MHz
• Output drive capability: 600Ω, 10VRMS at VS=±18V
• Input noise voltage: 4nVń ǸHz
• DC voltage gain: 100000
• AC voltage gain: 6000 at 10kHz
• Power bandwidth: 200kHz
• Slew rate: 13V/µs
• Large supply voltage range: ±3 to ±20V
PIN CONFIGURATIONS
NE/SA/SE5534/5534A
D, FE, N Packages
BALANCE 1
INVERTING INPUT 2
NON-INVERTING 3
V- 4
8 BALANCE/ COMPENSATION
7 V+
6 OUTPUT
5 COMPENSATION
TOP VIEW
NE5533/5533A
N Package
INV INPUT A 1
NON–INV INPUT A 2
BALANCE A 3
V– 4
BALANCE B 5
NON–INV B 6
INV B 7
14 BAL COMP A
13 COMP A
12 OUTPUT A
11 V+
10 OUTPUT B
9 COMP B
8 BAL COMP B
TOP VIEW
APPLICATIONS
• Audio equipment
• Instrumentation and control circuits
• Telephone channel amplifiers
• Medical equipment
ORDERING INFORMATION
DESCRIPTION
14-Pin Plastic Dual In-Line Package (DIP)
14-Pin Plastic Dual In-Line Package (DIP)
8-Pin Plastic Small Outline (SO) package
8-Pin Hermetic Ceramic Dual In-Line Package (CERDIP)
8-Pin Plastic Dual In-Line Package (DIP)
8-Pin Plastic Small Outline (SO) package
8-Pin Hermetic Ceramic Dual In-Line Package (CERDIP)
8-Pin Plastic Dual In-Line Package (DIP)
8-Pin Plastic Dual In-Line Package (DIP)
8-Pin Plastic Small Outline (SO) package
8-Pin Plastic Dual In-Line Package (DIP)
8-Pin Hermetic Ceramic Dual In-Line Package (CERDIP)
8-Pin Plastic Dual In-Line Package (DIP)
8-Pin Plastic Dual In-Line Package (DIP)
TEMPERATURE RANGE
0 to +70°C
0 to +70°C
0 to +70°C
0 to +70°C
0 to +70°C
0 to +70°C
0 to +70°C
0 to +70°C
-40°C to +85°C
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
-55°C to +125°C
-40°C to +85°C
ORDER CODE
NE5533N
NE5533AN
NE5534D
NE5534FE
NE5534N
NE5534AD
NE5534AF
NE5534AN
SA5534N
SA5534AD
SE5534N
SE5534AF
SE5534AN
SA5534AN
DWG #
0405B
0405B
0174C
0404B
0174C
0404B
0404B
0174C
0404B
0404B
0404B
August 31, 1994
114 853-0222 13721
Philips Semiconductors Linear Products
Dual and single low noise op amp
Product specification
NE5533/5533A/
NE/SA/SE5534/5534A
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNIT
VS
VIN
VDIFF
TA
TSTG
TJ
PD
Supply voltage
Input voltage
Differential input voltage1
Operating temperature range
SE
SA
NE
Storage temperature range
Junction temperature
Power dissipation at 25°C2
16D Pkg
±22
±V supply
±0.5
-55 to +125
-40 to +85
0 to +70
-65 to +150
150
1350
V
V
V
°C
°C
°C
°C
°C
mW
16N Pkg
1500
mW
8D Pkg
750 mW
8FE Pkg
800 mW
8N Pkg
Output short-circuit duration3
1150
Indefinite
mW
TSOLD
Lead soldering temperature (10sec max)
300 °C
NOTES:
1. Diodes protect the inputs against over voltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential
input voltage exceeds 0.6V. Maximum current should be limited to ±10mA.
2. For operation at elevated temperature, derate packages based on the following junction-to-ambient thermal resistance:
8-pin ceramic DIP 150°C/W
8-pin plastic DIP 105°C/W
8-pin plastic SO 160°C/W
16-pin plastic DIP 80°C/W
16-pin plastic SO 90°C/W
3. Output may be shorted to ground at VS=±15V, TA=25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating is
not exceeded.
August 31, 1994
115
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