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Siemens |
3.3 V 16M × 64/72-Bit SDRAM Modules
3.3 V 32M × 64/72-Bit SDRAM Modules
3.3 V 64M × 64/72-Bit SDRAM Modules
PC100-168 pin unbuffered DIMM Modules
HYS 64/72V16200GU
HYS 64/72V32220GU
HYS 64/72V32200GU
HYS 64/72V64220GU
Preliminary Information
• 168 Pin unbuffered 8 Byte Dual-In-Line SDRAM Modules for PC main memory applications
• One bank 16M × 64, 16M × 72, 32M × 64 and 32M × 72 organization
• Two bank 32M × 64, 32M × 72, 64M × 64 and 64M × 72 organization
• Optimized for byte-write non-parity or ECC applications
• Fully PC board layout compatible to INTEL’s Rev. 1.0 module specification
• JEDEC standard Synchronous DRAMs (SDRAM)
• SDRAM Performance:
fCK Clock frequency (max.)
tAC Clock access time
• Programmed Latencies:
-8 -8B Units
100 100 MHz
6 6 ns
Product Speed
-8 PC100
-8B PC100
CL
2
3
tRCD
2
2
tRP
2
3
• Single + 3.3 V (± 0.3 V) power supply
• Programmable CAS Latency, Burst Length and Wrap Sequence
(Sequential & Interleave)
• Auto Refresh (CBR) and Self Refresh
• Decoupling capacitors mounted on substrate
• All inputs, outputs are LVTTL compatible
• Serial Presence Detect with E2PROM
• Utilizes 32M × 8 SDRAMs in TSOPII-54 packages
• Uses SIEMENS 128Mbit and 256Mbit SDRAM components
• Gold contact pad
• Card Size: 133.35 mm × 31.75 mm × 4.00 mm
Semiconductor Group
1
1998-08-01
HYS 64(72)V16200/3222(0)0/64220GU
SDRAM Modules
The HYS 64/72V1600, HYS 64/72V32220, HYS 64/72V32200 and HYS 64/72V64220 are industry
standard 168-pin 8-byte Dual in-line Memory Modules (DIMMs) which are organized as 16M × 64,
16M × 72, 32M × 64 and 32M × 72 in 1 bank and 32M × 64, 32M × 72, 64M × 64 and 64M × 72 in
two banks high speed memory arrays designed with 128M and 256M Synchronous DRAMs
(SDRAMs) for non-parity and ECC applications. The DIMMs use -8 and -8B speed sort for 16M × 8
and 32M × 8 SDRAM devices in TSOP-54 packages to meet the PC100 requirement. Decoupling
capacitors are mounted on the PC board. The PC board design is according to INTEL’s PC 100
module specification.
The DIMMs have a serial presence detect, implemented with a serial E2PROM using the two pin I2C
protocol. The first 128 bytes are utilized by the DIMM manufacturer and the second 128 bytes are
available to the end user.
All SIEMENS 168-pin DIMMs provide a high performance, flexible 8-byte interface in a 133.35 mm
long footprint, with 1.25“ (31.75 mm) height.
Ordering Information
Type
Ordering Code
HYS 64V16200GU-8 PC100-222-620
HYS 72V16200GU-8 PC100-222-620
HYS 64V32220GU-8 PC100-222-620
HYS 72V32220GU-8 PC100-222-620
HYS 64V16200GU-8B PC100-323-620
HYS 72V16200GU-8B PC100-323-620
HYS 64V32220GU-8B PC100-323-620
HYS 72V32220GU-8B PC100-323-620
HYS 64V32200GU-8 PC100-222-620
HYS 72V32200GU-8 PC100-222-620
HYS 64V64220GU-8 PC100-222-620
HYS 72V64220GU-8 PC100-222-620
Package
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
L-DIM-168-30
Descriptions
PC100 16M × 64 1 bank
SDRAM module
PC100 16M × 72 1 bank
SDRAM module
PC100 32M × 64 2 bank
SDRAM module
PC100 32M × 72 2 bank
SDRAM module
PC100 16M × 64 1 bank
SDRAM module
PC100 16M × 72 1 bank
SDRAM module
PC100 32M × 64 2 bank
SDRAM module
PC100 32M × 72 2 bank
SDRAM module
PC100 32M × 64 1 bank
SDRAM module
PC100 32M × 72 1 bank
SDRAM module
PC100 64M × 64 2 bank
SDRAM module
PC100 64M × 72 2 bank
SDRAM module
Module
Height
1.25“
1.25“
1.25“
1.25“
1.25“
1.25“
1.25“
1.25“
1.25“
1.25“
1.25“
1.25“
Semiconductor Group
2
1998-08-01
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