PCA9504ADGG 반도체 회로 부품 판매점
Glue chip 4
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 NXP Semiconductors |
INTEGRATED CIRCUITS
PCA9504A
Glue chip 4
Product data
Supersedes data of 2003 Nov 10
Philips
Semiconductors
2004 May 11
Philips Semiconductors
Glue chip 4
Product data
PCA9504A
FEATURES
• Dual, Strapping, Selectable Feature Sets
• Audio-disable Circuit
• Mute Audio Circuit
• 5 V reference generation
• 5 V standby reference generation
• HD single color LED driver
• IDE reset signal generation/PCIRST# buffers
• PWROK (PWRGD_3V) signal generation
• Power Sequencing / BACKFEED_CUT
• Power Supply turn on circuitry
• RMSRST# generation
• Voltage translation for DDC to VGA monitor
• HSYNCH / VSYNCH voltage translation to VGA monitor
• 3-state buffers for test
• Extra GP Logic gates
• Power LED Drivers
• Flash FLUSH# / INIT# circuit
• 5 V I2C to 3.3 V SMBus conversion to 400 kHz
• Requires both 3.3 V and 5.0 V operating voltages
• 0 to +70 °C operating temperature range
• ESD protection exceeds 1000 V HBM per JESD22-A114 and
750 V CDM per JESD22-C101
• Latch-up testing is done to JEDEC Standard JESD78 which
exceeds 100 mA
• Package offered: TSSOP56
DESCRIPTION
The PCA9504A Glue Chip 4 is a highly integrated and cost-efficient
custom ASIC that reduces logic part count, overall component cost,
and board space requirements for PC designers and manufacturers.
The Glue Chip 4 supports the latest generation of high-volume
platforms based on Intel® processors and chipsets that require
additional external circuitry in order to function properly. It is used on
entry servers/workstations (840 and 860 chipsets), high-end
desktops (820 and 850 chipsets), as well as mid range (815, 830
and 845 chipsets) and low-end (810 chipset) motherboards. Some
of these functionalities include meeting timing specifications,
buffering signals, and switching between power wells.
The PCA9504A Glue Chip 4 integrates miscellaneous motherboard
logic and analog functions into a single, small footprint 56-pin
TSSOP device. The Glue Chip 4 typically resides on the
motherboard close to the I/O controller Hub (ICH) and is optimized
for the Intel 82801BA I/O controller hub (ICH2).
PIN CONFIGURATION
VREF3IN 1
V_5P0_STBY 2
V_3P3_STBY 3
GPO_FLUSH_CACHE/GP1_IN 4
A20M/GP1_INB 5
INIT/GP1_INA 6
FLUSH_OUT_CPU/GP1_OUT 7
INIT_OUT/GP2_OUT 8
CLK_IN 9
SEL_33_66 10
GND 11
PCIRST 12
PCRIST_OUT 13
AUD_EN 14
AUD_RST 15
IDE_RSTDRV 16
3V_DDCSCL 17
5V_DDCSCL 18
3V_DDCSDA 19
5V_DDCSDA 20
CPU_PRESENT 21
SLP_S3 22
PS_ON 23
HD_LED 24
PRIMARY_HD 25
SCSI 26
SECONDARY_HD 27
BACKFEED_CUT 28
56 GP3_OUT
55 GP3_IN
54 STRAP
53 VCCP_VREF
52 VSYNC_5V
51 HSYNC_5V
50 VSYNC_3V
49 HSYNC_3V
48 REF5V_STBY
47 AUD_SHDN
46 MUTE_AUD
45 VREF5IN
44 REF5V
43 GND
42 RSMRST
41 TEST_EN
40 GRN_LED
39 YLW_LED
38 YLW_BLNK
37 GRN_BLNK
36 SLP_S5
35 SCK_BJT_GATE
34 PWRGD_3V
33 FPRST
32 PWRGD_PS
31 FLUSH_OUT_FWH
30 LATCHED_BACKFED_CUT
29 GND
SW00578
ORDERING INFORMATION
PACKAGE
TEMPERATURE RANGE
ORDER CODE
TOPSIDE MARK
56-Pin Plastic TSSOP
0 °C to +70 °C
PCA9504ADGG
PCA9504ADGG
Standard packing quantities and other packaging data are available at www.philipslogic.com/packaging.
DRAWING NUMBER
SOT364-1
2004 May 11
2
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