M14C32DD 반도체 회로 부품 판매점
M14C32 Die Description
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 STMicroelectronics |
M14C32 DD
M14C32 Die Description
PRODUCT
s WAFER SIZE
M14C32
152 mm (6 inches)
s DIE IDENTIFICATION M14C32KA_R
s DIE SIZE (X x Y)
2040 x 2355 µm
s SCRIBE LINE
100.5 x 101.7 µm
s PAD OPENING
100 x 100 µm
DIE LAYOUT
s DI
Die Identification (at the position shown in Figure 1)
s C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
s C4, C6, C8
These ISO pins do not appear on the M14C32 die
s NC
This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in µm).
Figure 1. M14C32 Die Plot
C7: SDA (X= –649.92; Y= +993.44)
C5: GND (X= +718.0; Y= +1010.0)
NC: TEST
DI
NC: TEST
C3: SCL
(X= –837.28; Y= –904.24)
C2: WC (X= –648.48; Y= –993.6)
DD.M14C32/9811V1.1
AI02495
NC: TEST
C1: VCC (X= +650.08; Y= –993.76)
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M14C32 DD
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to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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