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Datasheet CMSSH-3A Equivalent ( PDF )

N.º Número de pieza Descripción Fabricantes Category
1CMSSH-3ASUPER-MINI SCHOTTKY DIODES

W NE CMSSH-3 CMSSH-3A CMSSH-3C CMSSH-3S Central DESCRIPTION TM Semiconductor Corp. SUPER-MINI SCHOTTKY DIODES SUPER mini CMSSH-3 CMSSH-3A CMSSH-3C CMSSH-3S TM The CENTRAL SEMICONDUCTOR CMSSH-3 Series types are Silicon Schottky diodes, epoxy molded in a super-mini surface mount package, desig
Central Semiconductor Corp
Central Semiconductor Corp
diode
2CMSSH-3AEENHANCED SPECIFICATION SURFACE MOUNT SILICON SCHOTTKY DIODES

CMSSH-3E CMSSH-3AE CMSSH-3CE CMSSH-3SE w w w. c e n t r a l s e m i . c o m ENHANCED SPECIFICATION SURFACE MOUNT SILICON SCHOTTKY DIODES DESCRIPTION: The CENTRAL SEMICONDUCTOR CMSSH-3E Series types are Enhanced Versions of the CMSSH-3 Series of Silicon Schottky Diodes in an SOT-323 Surface Mount
Central Semiconductor
Central Semiconductor
diode


CMS Datasheet ( Hoja de datos ) - resultados coincidentes

N.º Número de pieza Descripción Fabricantes Catagory
1CMS-S032-020SCHOTTKY BARRIER DIODE

CMS-S032-020 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.814 * 0.814 mm 2 Bond Pad size(B)) : 0.686 * 0.686 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Me
Champion Microelectronic
Champion Microelectronic
diode
2CMS-S032-040SCHOTTKY BARRIER DIODE

CMS-S032-040 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.814 * 0.814 mm 2 Bond Pad size(B) : 0.686 * 0.686 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Met
Champion Microelectronic
Champion Microelectronic
diode
3CMS-S035-020SCHOTTKY BARRIER DIODE

CMS-S035-020 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.889 * 0.889 mm 2 Bond Pad size(B) : 0.762 * 0.762 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Met
Champion Microelectronic
Champion Microelectronic
diode
4CMS-S035-040SCHOTTKY BARRIER DIODE

CMS-S035-040 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.889 * 0.889 mm 2 Bond Pad size(B) : 0.762 * 0.762 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Met
Champion Microelectronic
Champion Microelectronic
diode
5CMS-S040-020SCHOTTKY BARRIER DIODE

CMS-S040-020 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Met
Champion Microelectronic
Champion Microelectronic
diode
6CMS-S040-040SCHOTTKY BARRIER DIODE

CMS-S040-040 SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode
Champion
Champion
diode
7CMS-S040-040LSCHOTTKY BARRIER DIODE

CMS-S040-040L SCHOTTKY BARRIER DIODE Features : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Me
Champion Microelectronic
Champion Microelectronic
diode



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nuevas actualizaciones

Número de pieza Descripción Fabricantes PDF
SPS122

Modern EU gaming Machines require increased +12V current to accommodate the latest gaming peripherals. DC Converters have been engineered with Sanken’s latest technology to efficiently convert redundant power from our lamp gaming PSU and provide additional +12V capacity at the point of use.

Sanken
Sanken
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