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MCC
omponents
21201 Itasca Street Chatsworth
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Features
l For surface mount applicationsin or der to optimize
boar d space
l L ow pr ofil e package
l Fast response time: typical less than 1.0ps from 0 volts to
VBR minimum
l Low inductance
l Excellent clamping capability
Mechanical Data
l CASE: JEDEC DO-214AA
l Terminals: solderable per MIL-STD-750, Method 2026
l Polarity: Color band denotesposit ive end (cathode)
except Bidirectional
l Maximum soldering temperature: 260oC for 10 seconds
Maximum Ratings @ 25oC Unless Otherwise Specified
Peak Pulse Current on
10/1000us waveform
Peak Pulse Power
Dissipation
Peak Forward Surge
Current
IPP See Table 1 Note: 1
PPP
IFSM)
600W
100A
Note: 1,
2
Note: 2
3
Operation And Storage TJ, TSTG
Temperature Range
Thermal Resistance
R
-55oC to
+150oC
25oC/W
NOTES:
1. Non-repetitive current pulse, per Fig.3 and derated above
2.
TA=25oC
Mounted
per Fig.2.
on 5.0mm2
copper
pads
to
each
terminal.
3. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
4. Peak pulse current waveform is 10/1000us, with maximum duty
Cycle of 0.01%.
SMBJ5.0
THRU
SMBJ170CA
Transient
Voltage Suppressor
5.0 to 170 Volts
600 Watt
DO-214AA
(SMBJ) (LEAD FRAME)
G
H
D
E
F
A
C
B
DIMENSIONS
INCHES
DIM MIN
MAX
A .083
.096
B .075 .083
C .002
.008
D .006- .012
E .030 .050
F .200 .220
G .160
.185
H .130
.155
MM
MIN
2.13
1.91
0.051
0.152
0.76
5.08
4.06
3.30
MAX
2.44
2.11
0.203
0.305
1.27
5.59
4.70
3.94
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.082”
0.050”
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