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PDF LM60BIM3 Data sheet ( Hoja de datos )
| Número de pieza | LM60BIM3 | |
| Descripción | 2.7V/ SOT-23 or TO-92 Temperature Sensor | |
| Fabricantes | National Semiconductor | |
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July 2001
LM60
2.7V, SOT-23 or TO-92 Temperature Sensor
General Description
The LM60 is a precision integrated-circuit temperature sen-
sor that can sense a −40˚C to +125˚C temperature range
while operating from a single +2.7V supply. The LM60’s
output voltage is linearly proportional to Celsius (Centigrade)
temperature (+6.25 mV/˚C) and has a DC offset of +424 mV.
The offset allows reading negative temperatures without the
need for a negative supply. The nominal output voltage of the
LM60 ranges from +174 mV to +1205 mV for a −40˚C to
+125˚C temperature range. The LM60 is calibrated to pro-
vide accuracies of ±2.0˚C at room temperature and ±3˚C
over the full −25˚C to +125˚C temperature range.
The LM60’s linear output, +424 mV offset, and factory cali-
bration simplify external circuitry required in a single supply
environment where reading negative temperatures is re-
quired. Because the LM60’s quiescent current is less than
110 µA, self-heating is limited to a very low 0.1˚C in still air in
the SOT-23 package. Shutdown capability for the LM60 is
intrinsic because its inherent low power consumption allows
it to be powered directly from the output of many logic gates.
Features
n Calibrated linear scale factor of +6.25 mV/˚C
n Rated for full −40˚ to +125˚C range
n Suitable for remote applications
n Available in SOT-23 and TO-92 packages
Applications
n Cellular Phones
n Computers
n Power Supply Modules
n Battery Management
n FAX Machines
n Printers
n HVAC
n Disk Drives
n Appliances
Key Specifications
n Accuracy at 25˚C: ±2.0 and ±3.0˚C (max)
n Accuracy for −40˚C to +125˚C: ±4.0˚C (max)
n Accuracy for −25˚C to +125˚C: ±3.0˚C (max)
n Temperature Slope: +6.25mV/˚C
n Power Supply Voltage Range: +2.7V to +10V
n Current Drain @ 25˚C: 110µA (max)
n Nonlinearity: ±0.8˚C (max)
n Output Impedance: 800Ω (max)
Typical Application
Connection Diagrams
SOT-23
VO = (+6.25 mV/˚C x T ˚C) + 424 mV
01268102
Temperature (T)
+125˚C
+100˚C
+25˚C
0˚C
−25˚C
−40˚C
Typical VO
+1205 mV
+1049 mV
+580 mV
+424 mV
+268 mV
+174 mV
FIGURE 1. Full-Range Centigrade Temperature Sensor
(−40˚C to +125˚C) Operating from a Single Li-Ion
Battery Cell
© 2001 National Semiconductor Corporation DS012681
01268101
Top View
See NS Package Number MA03B
TO-92
01268123
See NS Package Number Z03A
www.national.com
1 page  
Typical Performance Characteristics To generate these curves the LM60 was mounted to a
printed circuit board as shown in Figure 2. (Continued)
Supply Voltage
vs Supply Current
Start-Up Response
01268112
01268122
01268114
FIGURE 2. Printed Circuit Board Used
for Heat Sink to Generate All Curves.
1⁄2" Square Printed Circuit Board
with 2 oz. Copper Foil or Similar.
1.0 Mounting
The LM60 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or
cemented to a surface. The temperature that the LM60 is
sensing will be within about +0.1˚C of the surface tempera-
ture that LM60’s leads are attached to.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the
actual temperature of the LM60 die would be at an interme-
diate temperature between the surface temperature and the
air temperature.
To ensure good thermal conductivity the backside of the
LM60 die is directly attached to the GND pin. The lands and
traces to the LM60 will, of course, be part of the printed
circuit board, which is the object whose temperature is being
measured. These printed circuit board lands and traces will
not cause the LM60’s temperature to deviate from the de-
sired temperature.
Alternatively, the LM60 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM60 and
accompanying wiring and circuits must be kept insulated and
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where conden-
sation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to
ensure that moisture cannot corrode the LM60 or its connec-
tions.
The thermal resistance junction to ambient (θJA ) is the
parameter used to calculate the rise of a device junction
temperature due to the device power dissipation. For the
LM60 the equation used to calculate the rise in the die
temperature is as follows:
TJ = TA + θ JA [(+VS IQ) + (+VS − VO) IL]
where IQ is the quiescent current and ILis the load current on
the output.
The table shown in Figure 3 summarizes the rise in die
temperature of the LM60 without any loading, and the ther-
mal resistance for different conditions.
5 www.national.com
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| PDF Descargar | [ Datasheet LM60BIM3.PDF ] | |
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