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PDF SRF-1016 Data sheet ( Hoja de datos )
| Número de pieza | SRF-1016 | |
| Descripción | Silicon Germanium IF Receiver | |
| Fabricantes | Sirenza Microdevices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SRF-1016 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Product Description
The Sirenza Microdevices’ SRF-1016 is a quadrature demodulator
RFIC designed for UHF and microwave receiver IF applications. This
device features switchable gain control, high P1dB, and excellent I/Q
amplitude and phase balance.
Use of this highly integrated device can result in lower component
count, a more compact assembly, and higher transceiver card yields.
The device is packaged in an industry standard 16 pin TSSOP with
exposed paddle for superb RF and thermal ground.
The matte tin finish on Sirenza’s lead-free package utilizes a post
annealing process to mitigate tin whisker formation and is RoHS com-
pliant per EU directive 2002/95. This package is also manufactured
with green molding compounds that contain no antimony trioxide nor
halogenated fire retardants.
Functional Block Diagram
BBIN 1
BBIP 2
VCC 3
GC2 4
www.DataSheet4U.cGomC1 5
VEE 6
VCC 7
INP 8
0/90
16 BBQP
15 BBQN
14 VCC
13 LOP
12 LON
11 VEE
10 VCC
9 INN
Preliminary Data Sheet
SRF-1016
SRF-1016Z
Pb RoHS Compliant
& Green Package
65 - 300 MHz
Silicon Germanium IF Receiver
16 pin TSSOP with Exposed Ground Pad
Package Footprint: 0.197 x 0.252 inches (5.0 x 6.4 mm)
Package Height: 0.039 inches (1.0 mm)
Product Features
• Available in Lead Free, RoHS compliant, and
Green packaging
• Gain control in 20dB steps
• Excellent I/Q amplitude and phase balance
• Output P1dB > +4 dBm over all gain settings
Applications
• Digital and spread spectrum communication
systems
• Cellular, PCS, DCS, 2G, 2.5G, 3G transceivers
• ISM band transceivers
• Point-to-point microwave receivers
• Broadband wireless systems
Product Specifications – IF Input (Test conditions are on page 2)
Parameters
Test Conditions
IF Frequency Range
INP/INN Return Loss
50 ohm nominal differential input, Note 1
INP/INN Common mode voltage Internally generated
Gain
Input P1dB
DSB Noise Figure
High gain setting
GC1 = GC2 = +5V
Gain
Input P1dB
DSB Noise Figure
Medium gain setting
GC1 = +5V
GC2 = 0V
Gain
Input P1dB
DSB Noise Figure
Low gain setting
GC1 = GC2 = 0V
Unit
MHz
dB
V
dB
dBm
dB
dB
dBm
dB
dB
dBm
dB
Min.
65
28
-26
9
-8
-9
12
Typ.
20
2
31
-24
11
12
-6
14.5
-6.5
14
31
Max.
300
33
14
-4
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or ommisions.
Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the
circuits described herein are implied or granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2006 Sirenza Microdevices, Inc. All
worldwide rights reserved.
303 South Technology Court
Broomfield, CO 80021
Phone: (800) SMI-MMIC
1
http://www.sirenza.com
EDS 102092 Rev B
1 page  
Package Dimensions
Dimensions in inches (mm)
0.193 (4.9)
0.207 (5.25)
XXX
XXXX
LOT ID
0.252 (6.4)
Part #
0.169 (4.3)
0.177 (4.5)
Lot #
0.004 (0.1)
0.008 (0.2)
0.018 (0.45)
0.030 (0.75)
EXPOSED
THERMAL
PAD ZONE
0.118 (3.0) SQ.
NOTES:
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS.
0.031 (0.8)
0.041 (1.05)
2. TOLERANCE ±0.1MM UNLESS OTHERWISE
SPECIFIED.
3. COPLANARITY: 0.1MM
4. CONTROLLING DIMENSION IS MILLIMETER,
0.0
0.006 (0.15)
CONVERTED INCH DIMENSIONS ARE NOT
NECESSARILY EXACT.
5. FOLLOWED FROM JEDEC MO-153.
0.026 (.65)
0.007 (0.19)
0.012 (0.30)
0°
8°
Preliminary Data Sheet
SRF-1016 SiGe IF Receiver
Suggested PCB Pad Layout
0.012
(0.30)
0.049
(1.25)
0.024
(0.63)
0.118
(3.0)
0.014
(0.35)
0.118
(3.0)
φ0.010 (0.25) via
0.028
(0.7)
0.035
(0.9)
0.272 (6.9)
all units are in inches (mm)
- Indicates metalization - vias connect pad to underlying ground plane
Pin Out Description
Pin #
Function
Description
1
BBIN
Baseband I-axis output (-)
2
BBIP
Baseband I-axis output (+)
3
VCC
Positive power supply
4
GC2
Gain control input, stage 2
5
GC1
Gain control input, stage 1
6
VEE
Ground
7
VCC
Positive power supply
8 INP IF input (+)
9 INN IF input (-)
10
VCC
Positive power supply
11
VEE
Ground
12
LON
LO input (-)
13
LOP
LO input (+)
14
VCC
Positive power supply
15
BBQN
Baseband Q-axis output (-)
16
BBQP
Baseband Q-axis output (+)
self-biasing
self-biasing
Additional Comments
5V CMOS levels
5V CMOS levels
self-biasing; AC-couple
self-biasing; AC-couple
self-biasing; AC-couple
self-biasing; AC-couple
self-biasing
self-biasing
303 South Technology Court
Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS102092 Rev B
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SRF-1016.PDF ] | |
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