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PDF LP61L256C Data sheet ( Hoja de datos )
| Número de pieza | LP61L256C | |
| Descripción | 32K X 8 BIT HIGH SPEED CMOS SRAM | |
| Fabricantes | AMIC Technology | |
| Logotipo |  |
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LP61L256C
Preliminary
32K X 8 BIT HIGH SPEED CMOS SRAM
Document Title
32K X 8 BIT HIGH SPEED CMOS SRAM
Revision History
Rev. No. History
0.0 Initial issue
Issue Date
November 9, 2001
Remark
Preliminary
PRELIMINARY (November, 2001, Version 0.0)
AMIC Technology, Inc.
1 page  
LP61L256C Series
Truth Table
Mode
Standby
Output Disable
Read
Write
CE OE WE
HXX
L HH
L LH
LXL
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
CIN*
CI/O*
Parameter
Input Capacitance
Input/Output Capacitance
Min.
* These parameters are sampled and not 100% tested.
AC Characteristics (TA = 0°C to +70°C, VCC = 3.3V ± 10%)
I/O Operation
High Z
High Z
DOUT
DIN
Max.
10
10
Unit
pF
pF
Supply Current
ISB, ISB1
ICC1
ICC1
ICC1
Conditions
VIN = 0V
VI/O = 0V
Symbol
Parameter
Read Cycle
tRC Read Cycle Time
tAA Address Access Time
tACE Chip Enable Access Time
tOE Output Enable to Output Valid
tCLZ Chip Enable to Output in Low Z
tOLZ Output Enable to Output in Low Z
tCHZ Chip Disable Output in High Z
tOHZ Output Disable to Output in High Z
tOH Output Hold from Address Change
LP61L256C-12
Min.
Max.
LP61L256C-15
Min.
Max.
Unit
12 - 15 - ns
- 12 - 15 ns
- 12 - 15 ns
- 6 - 8 ns
3 - 3 - ns
0 - 0 - ns
0 6 - 8 ns
0 6 0 8 ns
3 - 3 - ns
PRELIMINARY (November, 2001, Version 0.0)
4
AMIC Technology, Inc.
5 Page 
Package Information
SOJ 28L Outline Dimensions
28
15
LP61L256C Series
unit: inches/mm
1 14
D
S
Seating Plane
b
b1
e
y
e1
Symbol
A
A1
A2
b1
b
C
D
E
e
e1
HE
L
S
y
Dimensions in inches
Min Nom Max
- - 0.140
0.027
-
-
0.095 0.100 0.105
0.028 TYP
0.018 TYP
0.010 TYP
- 0.710 0.730
0.295 0.300 0.305
0.050 BSC
0.255 0.265 0.275
0.329 0.337 0.345
0.077 0.087 0.097
- - 0.045
- - 0.004
Dimensions in mm
Min Nom Max
- - 3.56
0.69 -
-
2.41 2.54 2.67
0.71 TYP
0.46 TYP
0.25 TYP
- 18.03 18.54
7.49 7.62 7.75
1.27 BSC
6.48 6.73 6.99
8.36 8.56 8.76
1.96 2.21 2.46
- - 1.14
- - 0.10
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension e1 is for PC Board surface mount pad pitch design
reference only.
4. Dimension S includes end flash.
PRELIMINARY (November, 2001, Version 0.0)
10
AMIC Technology, Inc.
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet LP61L256C.PDF ] | |
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