MAX16838 반도체 회로 부품 판매점
High-Brightness LED Driver
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 Maxim Integrated Products |
EVALUATION KIT AVAILABLE
MAX16838
Integrated, 2-Channel, High-Brightness LED Driver
with High-Voltage Boost and SEPIC Controller
General Description
The MAX16838 is a dual-channel LED driver that inte-
grates both the DC-DC switching boost regulator and
two 150mA current sinks. A current-mode switching
DC-DC controller provides the necessary voltage to
both strings of HB LEDs. The MAX16838 accepts a wide
4.75V to 40V input voltage range and directly withstands
automotive load-dump events. For a 5V Q10% input volt-
age, connect VIN to VCC. The wide input range allows
powering HB LEDs for small-to-medium-sized LCD dis-
plays in automotive and display backlight applications.
An internal current-mode switching DC-DC controller
supports the boost or SEPIC topologies and operates
in an adjustable frequency range between 200kHz and
2MHz. The current-mode control provides fast response
and simplifies loop compensation. The MAX16838 also
features an adaptive output-voltage adjustment scheme
that minimizes the power dissipation in the LED current
sink paths. The MAX16838 can be combined with the
MAX15054 to achieve a buck-boost LED driver with two
integrated current sinks.
The channel current is adjustable from 20mA to 150mA
using an external resistor. The external resistor sets both
channel currents to the same value. The device allows
connecting both strings in parallel to achieve a maximum
current of 300mA in a single channel. The MAX16838
also features pulsed dimming control with minimum
pulse widths as low as 1Fs, on both channels through a
logic input (DIM).
The MAX16838 includes an output overvoltage protec-
tion, open LED, shorted LED detection and overtempera-
ture protection. The device operates over the -40NC to
+125NC automotive temperature range. The MAX16838
is available in the 20-pin TSSOP and 4mm x 4mm, 20-pin
TQFN packages.
Applications
Automotive Display Backlights
LCD Display Backlights
Automotive Lighting Applications
Typical Operating Circuit and Pin Configurations appear at
end of data sheet.
Features
S Integrated, 2-Channel, 20mA to 150mA Linear LED
Current Sinks
S Boost or SEPIC Power Topologies for Maximum
Flexibility
S Adaptive Voltage Optimization to Minimize Power
Dissipation in Linear Current Sinks
S 4.75V to 40V or 5V ±10% Input Operating Voltage
Range
S 5000:1 PWM Dimming at 200Hz
S Open-Drain Fault Indicator Output
S LED Open/Short Detection and Protection
S Output Overvoltage and Overtemperature
Protection
S Programmable LED Current Foldback at Lower
Input Voltages
S 200kHz to 2MHz Resistor Programmable
Switching Frequency with External
Synchronization
S Current-Mode Control Switching Stage with
Internal Slope Compensation
S Enable Input
S Thermally Enhanced, 20-Pin TQFN (4mm x 4mm)
and 20-Pin TSSOP Packages
Ordering Information
PART
TEMP RANGE PIN-PACKAGE
MAX16838ATP+ -40NC to +125NC 20 TQFN-EP*
MAX16838ATP/V+ -40NC to +125NC
MAX16838AUP+ -40NC to +125NC
20 TQFN-EP*
20 TSSOP-EP*
MAX16838AUP/V+ -40NC to +125NC 20 TSSOP-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
/V denotes an automotive qualified part.
Simplified Schematic
4.75V TO 40V
CIN
L
D
R2OV
COUT
CCOMP
RCOMP
IN
EN
CFB
VCC
DRV
DIM
COMP
DRAIN OV
NDRV
GATE
OUT1
MAX16838
OUT2
ISET
FLT
CS
RT
SGND PGND LEDGND
R1OV
RISET
RRT RCS
LED
STRINGS
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-4972; Rev 3; 6/13
MAX16838
Integrated, 2-Channel, High-Brightness LED Driver
with High-Voltage Boost and SEPIC Controller
ABSOLUTE MAXIMUM RATINGS
IN, OUT_, DRAIN to SGND....................................-0.3V to +45V
EN to SGND................................................-0.3V to (VIN + 0.3V)
PGND to SGND.....................................................-0.3V to +0.3V
LEDGND to SGND................................................-0.3V to +0.3V
DRV to PGND........... -0.3V to the lower of (VIN + 0.3V) and +6V
GATE to PGND.........................................................-0.3V to +6V
NDRV to PGND........................................-0.3V to (VDRV + 0.3V)
VCC, FLT, DIM, CS, OV, CFB, to SGND..................-0.3V to +6V
RT, COMP, ISET to SGND..........................-0.3V to (VCC + 0.3V)
DRAIN and CS Continuous Current................................... Q2.5A
OUT_ Continuous Current.................................................175mA
VDRV Short-Circuit Duration ......................................Continuous
Continuous Power Dissipation (TA = +70NC)
20-Pin TQFN (derate 25.6mW/NC above +70NC).............2051mW
20-Pin TSSOP (derate 26.5mW/NC above +70NC).......2122mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
20 TQFN
Juction-to-Ambient Thermal Resistance (BJA)........... +39NC/W
Junction-to-Case Thermal Resistance (BJC)................ +6NC/W
20 TSSOP
Junction-to-Ambient Thermal Resistance (BJA)...... +37.7NC/W
Junction-to-Case Thermal Resistance (BJC)................ +2NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VIN = VEN = 12V, RRT = 12.2kI, RISET = 15kI, CVCC = 1FF, VCC = VDRV = VCFB, DRAIN, COMP, OUT_, FLT = unconnected, VOV
= VCS = VLEDGND = VDIM = VPGND = VSGND = 0V, VGATE = VNDRV, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical
values are at TA = 25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
Input Voltage Range
Quiescent Supply Current
Standby Supply Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
VIN
VIN
IQ
ISH
UVLOIN
Internal LDO on
VIN = VCC
VDIM = 5V
VEN = SGND (Note 3)
VIN rising, VDIM = 5V
4.75
40
4.55
5.5
3.1 5
15.5 40
4 4.3 4.55
177
V
V
mA
FA
V
mV
DRV REGULATOR
Output Voltage
VDRV
5.75V < VIN < 10V, 0.1mA < ILOAD < 30mA
6.5V < VIN < 40V, 0.1mA < ILOAD < 3mA
4.75
5
5.25
V
Dropout Voltage
Short-Circuit Current Limit
VDO
(VIN - VDRV)
VIN = 4.75V, IOUT = 30mA
DRV shorted to GND
0.11 0.5
97
V
mA
VCC Undervoltage Lockout
Threshold
UVLOVCC VCC rising
3.4 4.0 4.4
V
VCC (UVLO) Hysteresis
123 mV
2 Maxim Integrated
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MAX16838 led
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