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QT Optoelectronics |
HIGH EFFICIENCY RED
YELLOW
QTLP670C–2
QTLP670C–3
PACKAGE DIMENSIONS
.118 (3.0)
.102 (2.6)
.091 (2.3)
.083 (2.1)
.134 (3.4)
.118 (3.0)
Ø .04
(.1)
.083 (2.1)
.067 (1.7)
.035 (.9)
.028 (.7)
.142 (3.6)
.126 (3.2)
.094
(2.4)
CATHODE
ANODE FOR QTLP670C–7
.043 (1.1)
.020 (.5)
.024 (.6)
.016 (.4)
.007 (.18)
.005 (.12)
GREEN
AlGaAs RED
SMT LED LAMP
PLCC–2 PACKAGE
QTLP670C–4
QTLP670C–7
DESCRIPTION
The QT Optoelectronics surface mount lamps are
designed with a flat top and sides for automatic
placement equipment. They are compatible with con-
vective IR and vapor phase reflow soldering and con-
ductive epoxy attachment process.
The package size and configuration conform to the
EIA–535 BAAC standard specification for case 3528
tantalum capacitor.
FEATURES
s Non-diffused package for backlighting and
coupling to light pipe
s Low package profile
s Low power dissipation
s Wide viewing angle
NOTE: ALL DIMENSIONS ARE IN INCHES (mm)
ABSOLUTE MAXIMUM RATINGS (TA = 25° C Unless otherwise specified)
HER
Yellow
Green
AlGaAs Red
QTLP
670C–2
670C–3
670C–4
670C–7
DC forward current, IF
30 20
30
30
Operating temperature range
–40° C to +85° C
Storage temperature range
–40° C to +100° C
Lead soldering time
5 seconds @ 260° C
Peak forward current1, IF
160 160
160
200
Power dissipation Pd (mW)
100
100
100
100
Reversed Voltage (VR)
55
5
5
Units
mA
mA
mW
V
Notes:
1. Measured @ f=1.0 kHz, Duty factor = 1/10
HER = High Efficiency Red
SMT LED LAMP
PLCC–2 PACKAGE
ELECTRO-OPTICAL CHARACTERISTICS (TA = 25° C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
QTLP
HER
670C–2
LUMINOUS INTENSITY
minimum
6
typical
10
FORWARD VOLTAGE
minimum
1.7
typical
2.0
maximum
2.8
PEAK WAVELENGTH
635
SPECTRAL LINE HALF WIDTH 45
VIEWING ANGLE
120°
YELLOW
670C–3
6
10
1.7
2.0
2.8
585
35
120°
GREEN
670C–4
15
25
1.7
2.1
2.8
570
30
120°
AlGaAs
RED
670C–7
TEST
UNITS CONDITIONS
25 mcd IF = 20 mA
40 mcd
1.5
1.7
2.4
660
20
120°
V IF = 20 mA
V
V
nm IF = 20 mA
nm
SOLDERING
INFRARED VAPOR PHASE
REFLOW SOLDERING
4.45
(.175)
2.41
(.095)
COMPONENT LOCATION
ON PAD
1.65
(.065)
4.45
(.175)
2.41
(.095)
COMPONENT LOCATION
ON PAD
1.65
(.065)
0.64 (.025) SQ.
CENTERED HOLE
FIG. 1 - Recommended Solder Pad Patterns
Notes:
All dimensions are in millimeters (inches).
HER = High Efficiency Red
5 s MAX
soldering time
240° MAX
+5° C/s MAX
–5° C/s MAX
120 – 150° C MAX
60 – 120 sec
Preheating
FIG. 2 - Recommended IR Reflow Soldering Profile
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