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PDF SY88932L Data sheet ( Hoja de datos )
| Número de pieza | SY88932L | |
| Descripción | SONET/SDH LASER DRIVER | |
| Fabricantes | Micrel Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SY88932L (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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Micrel, Inc.
3.3V 3.2Gbps
SONET/SDH LASER DRIVER
WITH OUTPUT DISABLE
SY88932L
SY88932L
FEATURES
s Up to 3.2Gbps operation
s Modulation current to 60mA
s Rise/fall times 65ps typical
s Input 50Ω internally terminated to VCC
s TTL /EN with internal 75kΩ pull-down
s Designed for use with MIC3000 optical transceiver
management IC
s Voltage programmable laser modulation current
s Single 3.3V power supply
s Operating temperature range of –40°C to 85°C
s Available in tiny 16-pin MLF™ package
DESCRIPTION
The SY88932L is the smallest available laser driver with
a programmable modulation current up to 60mA for Fabry-
Perot (FP) or distributed feedback (DFB) lasers. The device
is suitable for SONET/SDH applications with data rates up
to 3.2Gbps. The SY88932L accepts either CML level or
AC-coupled PECL inputs, and incorporates an active low
TTL /EN function which shuts off the modulation current
when HIGH.
All support documentation can be found on Micrel’s web
site at www.micrel.com.
APPLICATIONS
s Fiber optical module
s Transponder
s XAUI CWDM
s SONET/SDH transmission system
s Add-drop MUX
s Metro area network
s 2.5Gbps optical transmitter
www.DataSheet4U.com
BLOCK DIAGRAM
VCC
REXT
/OUT
DIN
/DIN
Internal
Logic
/EN
VREF
Generator
Modulation
Control
IMOD
VREF
VCNTRL
GND
VCC
VCC
OUT
VCC
IBIAS
GND
MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc.
M9999-082205
[email protected] or (408) 955-1690
1
Rev.: E Amendment: /0
Issue Date: August 2005
1 page  
Micrel, Inc.
16 LEAD EPAD-MicroLeadFrame™ (MLF-16)
SY88932L
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
VEE
VEE
PCB Thermal Consideration for 16-Pin MLF™ Package
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474--1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
M9999-082205
[email protected] or (408) 955-1690
5
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| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet SY88932L.PDF ] | |
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