|
|
PDF SL2ICS2001V1D Data sheet ( Hoja de datos )
| Número de pieza | SL2ICS2001V1D | |
| Descripción | I-CODE SLI Label IC bumped wafer specification on UV-tape | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de SL2ICS2001V1D (archivo pdf) en la parte inferior de esta página. Total 9 Páginas | ||
|
No Preview Available !
SL2ICS2001DW/V1D
I-CODE SLI Label IC bumped wafer specification on UV-tape
Rev. 3.0 — 5 February 2008
150030
Product data sheet addendum
PUBLIC
1. General description
This specification describes the electrical, physical and dimensional properties of
Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP
C075EE process and is the base for delivery of tested I-CODE SLI Label ICs.
2. Ordering information
Table 1. Ordering information
Type number
Package
Name
SL2ICS2001DW/V1D
-
Description
Bumped die on sawn wafer on UV-tape
3. Mechanical specification
Odering code
9352 795 61005
3.1 Wafer
• Diameter:
• Thickness:
3.2 Wafer backside
www.DataSheet4U.com
• Material:
• Treatment:
• Roughness:
3.3 Chip dimensions
• Chip size:
• Scribe lines:
3.4 Passivation
• Type:
• Material:
• Thickness:
8”
150 μm ± 15 μm
Si
ground and stress release
Ra max. 0.5 μm
Rt max. 5 μm
900 x 780 μm2
80 / 80 μm
sandwich structure
PSG / Nitride (on top)
500 nm / 600 nm
1 page  
NXP Semiconductors
6. Characteristics
SL2ICS2001DW/V1D
I-CODE SLI Label IC bumped wafer specification on UV-tape
PUBLIC
6.1 Electrical characteristics
Table 3. Characteristics [1]
Symbol
Parameter
Conditions
Tjop = -25 to 85°C
VLA-LB
Minimum supply voltage for
READ/WRITE/EAS
fop Operating frequency
Cres Input capacitance between VLA-LB = 2 Vrms
LA – LB
Pmin Minimum operating supply
power
m
Modulation of RF voltage for
demodulator response
m = V-V---m-m---aa---xx---+-–----VV----mm----ii-n-n
tP sm
tD
Rmod
tret
nwrite
Modulation pulse length of
RF voltage
Demodulator response time m ≥ 10 %, 100 %
Load modulation
EEPROM Data retention
Tamb ≤ 55 °C
EEPROM Write endurance
[2]
[3]
[4]
[5]
[5]
[5]
[5]
Min Typ Max Unit
±2.5
13.553
22.3
±2.6
13.560
23.5
±2.9
13.567
24.7
Vrms
MHz
pF
- 280 - μW
---%
- - - μs
- - - μs
---Ω
10 - - Years
100000 - - Cycles
www.DataSheet4U.com
[1] Typical ratings are not guaranteed. These values listed are at room temperature.
[2] Bandwidth limitation (±7 kHz) according to ISM band regulations.
[3] Measured with an HP4285A LCR meter at 13.56 MHz.
[4] Including losses in resonant capacitor and rectifier.
[5] Refer to ISO/IEC 15693-2 and 15693-3 including pulse shapes and tolerances; proper coil design
assumed.
7. Final wafertest specification
• Mininum yield per wafer: 30 % of 35416 potential good dies.
• Minimum yield per lot: 30 %
150030
Product data sheet addendum
Rev. 3.0 — 5 February 2008
© NXP B.V. 2008. All rights reserved.
5 of 9
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet SL2ICS2001V1D.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| SL2ICS2001V1D | I-CODE SLI Label IC bumped wafer specification on UV-tape | NXP Semiconductors |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |