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Número de pieza | CY8C201A0 | |
Descripción | Configurable IOs | |
Fabricantes | Cypress Semiconductor | |
Logotipo | ||
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CY8C201A0
CapSense Express™ -10 Configurable IOs
with Slider
Features
■ 10 configurable IOs supporting
❐ CapSense slider
❐ LED drive
❐ Interrupt outputs
❐ WAKE on interrupt input
❐ User defined input or output
■ 2.4V to 5.25V operating voltage
■ Industrial temperature range: –40°C to +85°C
■ I2C slave interface for configuration
❐ Selectable to 50 kHz,100 kHz and 400 kHz.
■ Reduce BOM cost
❐ Internal oscillator - no external oscillators or crystal
❐ Free development tool - no external tuning components
■ Low operating current
❐ Active current: continuous sensor scan: 1.5 mA
❐ Sleep current: no scan, continuous sleep: 2.6 uA
■ Available in 16-pin COL and 16-pin SOIC packages
Overview
The CapSense ExpressTM controller allows the control of 10
IOs configurable as capacitive sensing buttons or as GPIOs
for driving LEDs or interrupt signals based on various button
conditions. The GPIOs are also configurable for waking up the
device from sleep based on an interrupt input.
The user has the ability to configure buttons, outputs, and
parameters, through specific commands sent to the I2C port.
The IOs have the flexibility in mapping to capacitive buttons
and as standard GPIO functions such as interrupt output or
input, LED drive and digital mapping of input to output using
simple logical operations. This enables easy PCB trace
routing and reduces the PCB size and stack up. CapSense
Express products are designed for easy integration into
complex products.
Architecture
The logic block diagram shows the internal architecture of
CY8C201A0.
The user can configure registers with parameters needed to
adjust the operation and sensitivity of the CapSense system.
CY8C201A0 supports a standard I2C serial communication
interface that allows the host to configure the device and to
read sensor information in real time through easy register
access.
The CapSense Express Core
The CapSense Express Core has a powerful configuration and
control block. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers. System
resources provide additional capability, such as a configurable
I2C slave communication interface and various system resets.
The Analog System is composed of the CapSense PSoC
block which supports capacitive sensing of up to 10 inputs.
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-17349 Rev. *B
• San Jose, CA 95134-1709 • 408-943-2600
Revised March 11, 2008
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CY8C201A0
The CapSense Analog System
The CapSense analog system contains the capacitive sensing
hardware which supports the CapSense Successive Approxi-
mation (CSA) algorithm. This hardware performs capacitive
sensing and scanning without external components. Capacitive
sensing is configurable on each pin.
Additional System Resources
System resources provide additional capability useful to
complete systems. Additional resources are low voltage
detection and power on reset. Brief statements describing the
merits of each system resource are:
■ The I2C slave provides 50, 100, or 400 kHz communication
over two wires.
■ Low Voltage Detection (LVD) interrupts can signal the appli-
cation of falling voltage levels and the advanced POR (Power
On Reset) circuit eliminates the need for a system supervisor.
An internal 1.8V reference provides a stable internal reference
so that capacitive sensing functionality is not affected by minor
VDD changes.
I2C Interface
The two modes of operation for the I2C interface are:
■ Device register configuration and status read or write for
controller
■ Command execution
The I2C address is programmable during configuration. It can be
locked to prevent accidental change by setting a flag in a config-
uration register.
CapSense Express Software Tool
An easy to use software tool integrated with PSoC Express is
available for configuring and tuning CapSense Express
devices.Refer to the Application Note AN42137 for details of the
software tool.
CapSense Express Register Map
CapSense Express supports user configurable registers through
which the device functionality and parameters are configured.
For details, refer to CY8C201xx Register Reference document.
Electrical Specifications
Absolute Maximum Ratings
Parameter
Description
Min Typ Max Unit
Notes
TSTG
Storage temperature
–55 25 +100 °C Higher storage temperatures reduce
data retention time. Recommended
storage temperature is +25°C ± 25°C
(0°C to 50°C). Extended duration
storage temperatures above 65°C
degrade reliability.
TA
Ambient temperature with power
–40 –
+85 °C
applied
VDD
VIO
VIOZ
IMIO
ESD
Supply voltage on VDD relative to VSS –0.5
–
+6.0
V
DC input voltage
VSS – 0.5 – VDD + 0.5 V
DC voltage applied to tri-state
VSS – 0.5 – VDD + 0.5 V
Maximum current into any GPIO pin –25
–
+50 mA
Electro static discharge voltage
2000 – – V Human body model ESD
LU Latch up current
– – 200 mA
Operating Temperature
Parameter
Description
TA Ambient temperature
TJ Junction temperature
Min Typ Max Unit
-40 – +85 °C
-40 – +100 °C
Notes
Document Number: 001-17349 Rev. *B
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CY8C201A0
Package Diagram
Figure 4. 16L Chip On Lead 3 X 3 mm Package Outline (SAWN) - 001-09116 - (Pb-Free)
DIMENSIONS IN mm MIN.
MAX.
2.9
3.1 0.20 min
0.20 DIA TYP.
1
2
2.9
3.1
0.60 MAX
0.152 REF.
0.05 MAX
SEATING PLANE
1.5 (NOM)
2
1
PIN #1 ID
0.30
0.18
0.50
1.5
0.45
0.55
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PART NO.
LG16A
LD16A
DESCRIPTION
LEAD-FREE
STANDARD
Figure 5. 16 Pin (150-Mil) SOIC (51-85068)
JEDEC # MO-220
Package Weight: 0.014g
001-09116-*C
Document Number: 001-17349 Rev. *B
51-85068-*B
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Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet CY8C201A0.PDF ] |
Número de pieza | Descripción | Fabricantes |
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