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PDF AM29LV065M Data sheet ( Hoja de datos )
| Número de pieza | AM29LV065M | |
| Descripción | Uniform Sector Flash Memory | |
| Fabricantes | AMD | |
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ADVANCE INFORMATION
Am29LV065M
64 Megabit (8 M x 8-Bit) MirrorBit 3.0 Volt-only
Uniform Sector Flash Memory with VersatileI/O Control
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
s Single power supply operation
— 3 volt read, erase, and program operations
s Enhanced VersatileI/O control
— Device generates data output voltages and tolerates
data input voltages as determined by the voltage on
the VIO pin; operates from 1.65 to 3.6 V
s Manufactured on 0.23 µm MirrorBit process
technology
s SecSi (Secured Silicon) Sector region
— 256-byte sector for permanent, secure identification
through an 16-byte random Electronic Serial Number,
accessible through a command sequence
— May be programmed and locked at the factory or by
the customer
s Flexible sector architecture
— One hundred twenty-eight 64 Kbyte sectors
s Compatibility with JEDEC standards
— Provides pinout and software compatibility for
single-power supply flash, and superior inadvertent
write protection
s Minimum 100,000 erase cycle guarantee per sector
s 20-year data retention at 125°C
PERFORMANCE CHARACTERISTICS
s High performance
— 90 ns access time
— 25 ns page read times
— 0.4 s typical sector erase time
— 3.0 µs typical write buffer byte programming time:
32-byte write buffer reduces overall programming
time for multiple-byte updates
— 8-byte read page buffer
— 32-byte write buffer
s Low power consumption (typical values at 3.0 V,
5 MHz)
— 30 mA typical active read current
— 50 mA typical erase/program current
— 1 µA typical standby mode current
s Package options
— 48-pin TSOP
— 63-ball FBGA
SOFTWARE & HARDWARE FEATURES
s Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-byte programming time
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
s Hardware features
— Sector Group Protection: hardware method of
preventing write operations within a sector group
— Temporary Sector Unprotect: VID-level method of
changing code in locked sectors
— ACC (high voltage) pin accelerates programming
time for higher throughput during system production
— Hardware reset pin (RESET#) resets device
— Ready/Busy# pin (RY/BY#) detects program or erase
cycle completion
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication# 25262 Rev: A Amendment/+1
Issue Date: October 3, 2001
Refer to AMD’s Website (www.amd.com) for the latest information.
1 page  
ADVANCE INFORMATION
CONNECTION DIAGRAMS
63-Ball FBGA
Top View, Balls Facing Down
A8 B8
NC* NC*
L8 M8
NC* NC*
A7 B7 C7 D7 E7 F7 G7 H7 J7 K7 L7 M7
NC* NC* A14 A13 A15 A16 A17 NC A20 VSS NC* NC*
C6 D6 E6 F6 G6 H6 J6 K6
A9 A8 A11 A12 A19 A10 DQ6 DQ7
C5 D5 E5 F5 G5 H5 J5 K5
WE# RESET# A22 NC DQ5 NC VCC DQ4
C4 D4 E4 F4 G4 H4 J4 K4
RY/BY# ACC NC
NC DQ2 DQ3 VIO A21
C3 D3 E3 F3 G3 H3 J3 K3
A7 A18
A6
A5 DQ0 NC
NC DQ1
A2
NC*
A1 B1
NC* NC*
C2 D2 E2 F2 G2 H2 J2 K2
A3 A4 A2 A1 A0 CE# OE# VSS
* Balls are shorted together via the substrate but not connected to the die.
L2
NC*
L1
NC*
M2
NC*
M1
NC*
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Am29LV065M
5
5 Page 
ADVANCE INFORMATION
REVISION SUMMARY
Revision A (August 3, 2001)
Initial release as abbreviated Advance Information
data sheet.
Revision A+1 (October 3, 2001)
Global
Added 120 ns device, changed 100 ns, VIO = 1.65–2.7
V device to 110 ns, changed 90 ns operating range to
3.0–3.6 V.
Physical Dimensions
Added section.
Trademarks
Copyright © 2001 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Am29LV065M
11
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