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PDF SST25VF010A Data sheet ( Hoja de datos )

Número de pieza SST25VF010A
Descripción 1 Mbit SPI Serial Flash
Fabricantes SST 
Logotipo SST Logotipo



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1 Mbit SPI Serial Flash
SST25VF010A
FEATURES:
SST25VF010A1Mb Serial Peripheral Interface (SPI) flash memory
Data Sheet
• Single 2.7-3.6V Read and Write Operations
• Serial Interface Architecture
– SPI Compatible: Mode 0 and Mode 3
• 33 MHz Max Clock Frequency
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption:
– Active Read Current: 7 mA (typical)
– Standby Current: 8 µA (typical)
• Flexible Erase Capability
– Uniform 4 KByte sectors
– Uniform 32 KByte overlay blocks
• Fast Erase and Byte-Program:
– Chip-Erase Time: 70 ms (typical)
– Sector- or Block-Erase Time: 18 ms (typical)
– Byte-Program Time: 14 µs (typical)
• Auto Address Increment (AAI) Programming
– Decrease total chip programming time over
Byte-Program operations
• End-of-Write Detection
– Software Status
• Hold Pin (HOLD#)
– Suspends a serial sequence to the memory
without deselecting the device
• Write Protection (WP#)
– Enables/Disables the Lock-Down function of the
status register
• Software Write Protection
– Write protection through Block-Protection bits in
status register
• Temperature Range
– Commercial: 0°C to +70°C
– Industrial: -40°C to +85°C
– Extended: -20°C to +85°C
• Packages Available
– 8-lead SOIC 150 mil body width
– 8-contact WSON (5mm x 6mm)
• All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
SST’s serial flash family features a four-wire, SPI-compati-
ble interface that allows for a low pin-count package occu-
pying less board space and ultimately lowering total system
costs. SST25VF010A SPI serial flash memory is manufac-
tured with SST’s proprietary, high performance CMOS
SuperFlash Technology. The split-gate cell design and
thick-oxide tunneling injector attain better reliability and
manufacturability compared with alternate approaches.
The SST25VF010A device significantly improves perfor-
mance, while lowering power consumption. The total
energy consumed is a function of the applied voltage, cur-
rent, and time of application. Since for any given voltage
range, the SuperFlash technology uses less current to pro-
gram and has a shorter erase time, the total energy con-
sumed during any Erase or Program operation is less than
alternative flash memory technologies. The SST25VF010A
device operates with a single 2.7-3.6V power supply.
The SST25VF010A device is offered in both 8-lead SOIC
and 8-contact WSON packages. See Figure 1 for the pin
assignments.
©2006 Silicon Storage Technology, Inc.
S71265-02-000
1/06
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

1 page




SST25VF010A pdf
1 Mbit SPI Serial Flash
SST25VF010A
Hold Operation
HOLD# pin is used to pause a serial sequence underway
with the SPI flash memory without resetting the clocking
sequence. To activate the HOLD# mode, CE# must be in
active low state. The HOLD# mode begins when the SCK
active low state coincides with the falling edge of the
HOLD# signal. The HOLD mode ends when the HOLD#
signal’s rising edge coincides with the SCK active low state.
If the falling edge of the HOLD# signal does not coincide
with the SCK active low state, then the device enters Hold
mode when the SCK next reaches the active low state.
Similarly, if the rising edge of the HOLD# signal does not
Data Sheet
coincide with the SCK active low state, then the device
exits in Hold mode when the SCK next reaches the active
low state. See Figure 3 for Hold Condition waveform.
Once the device enters Hold mode, SO will be in high-
impedance state while SI and SCK can be VIL or VIH.
If CE# is driven active high during a Hold condition, it resets
the internal logic of the device. As long as HOLD# signal is
low, the memory remains in the Hold condition. To resume
communication with the device, HOLD# must be driven
active high, and CE# must be driven active low. See Figure
18 for Hold timing.
SCK
HOLD#
Active
Hold
FIGURE 3: HOLD CONDITION WAVEFORM
Active
Hold
Active
1265 F03.0
Write Protection
The SST25VF010A provides software Write protection.
The Write Protect pin (WP#) enables or disables the lock-
down function of the status register. The Block-Protection
bits (BP1, BP0, and BPL) in the status register provide
Write protection to the memory array and the status regis-
ter. See Table 5 for Block-Protection description.
Write Protect Pin (WP#)
The Write Protect (WP#) pin enables the lock-down func-
tion of the BPL bit (bit 7) in the status register. When WP#
is driven low, the execution of the Write-Status-Register
(WRSR) instruction is determined by the value of the BPL
bit (see Table 3). When WP# is high, the lock-down func-
tion of the BPL bit is disabled.
TABLE 3: CONDITIONS TO EXECUTE WRITE-STATUS-
REGISTER (WRSR) INSTRUCTION
WP#
L
L
H
BPL
1
0
X
Execute WRSR Instruction
Not Allowed
Allowed
Allowed
T3.0 1265
©2006 Silicon Storage Technology, Inc.
5
S71265-02-000
1/06

5 Page





SST25VF010A arduino
1 Mbit SPI Serial Flash
SST25VF010A
Byte-Program
The Byte-Program instruction programs the bits in the
selected byte to the desired data. The selected byte must
be in the erased state (FFH) when initiating a Program
operation. A Byte-Program instruction applied to a pro-
tected memory area will be ignored.
Prior to any Write operation, the Write-Enable (WREN)
instruction must be executed. CE# must remain active low
for the duration of the Byte-Program instruction. The Byte-
Data Sheet
Program instruction is initiated by executing an 8-bit com-
mand, 02H, followed by address bits [A23-A0]. Following the
address, the data is input in order from MSB (bit 7) to LSB
(bit 0). CE# must be driven high before the instruction is
executed. The user may poll the Busy bit in the software
status register or wait TBP for the completion of the internal
self-timed Byte-Program operation. See Figure 6 for the
Byte-Program sequence.
CE#
MODE 3
SCK MODE 0
0 1 2345 6 78
15 16
23 24 31 32 39
SI 02
MSB
SO
FIGURE 6: BYTE-PROGRAM SEQUENCE
ADD.
MSB
ADD.
HIGH IMPEDANCE
ADD. DIN
MSB LSB
1265 F06.0
©2006 Silicon Storage Technology, Inc.
11
S71265-02-000
1/06

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