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PDF MCM72F10DG8 Data sheet ( Hoja de datos )

Número de pieza MCM72F10DG8
Descripción 8MB Synchronous Fast Static RAM Module
Fabricantes Motorola Semiconductors 
Logotipo Motorola Semiconductors Logotipo



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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
8MB Synchronous Fast Static
RAM Module
The MCM72F10 (2MB) is configured as 1M x 72 bits. It is packaged in a
168–pin dual–in–line memory module DIMM. The module uses Motorola’s 3.3 V,
256K x 18 bit flow–through BurstRAMs.
Address (A), data inputs (DQ, DP), and all control signals except output enable
(G) are clock (K) controlled through positive–edge–triggered noninverting
registers.
Write cycles are internally self–timed and initiated by the rising edge of the
clock (K) input. This feature provides increased timing flexibility for incoming
signals. Synchronous byte write (W) allows writes to either individual bytes or to
both bytes.
Single 3.3 V + 10%, – 5% Power Supply
Plug and Pin Compatibility with 1MB, 2MB, and 4MB
Multiple Clock Pins for Reduced Loading
All Inputs and Outputs are LVTTL Compatible
Byte Write Capability
Fast SRAM Access Times: 8/9/12 ns
High Quality Multi–Layer FR4 PWB With Separate Power and Ground
Planes
Amp Connector, Part Number: 390064–4
168–Pin DIMM Module
Order this document
by MCM72F10/D
MCM72F10
168–LEAD DIMM
CASE TBD
TOP VIEW
1
11
40
41
84
REV 1
11/26/97
M© OMoTtoOroRla,OInLc.A19F97AST SRAM
MCM72F10
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MCM72F10DG8 pdf
ABSOLUTE MAXIMUM RATINGS (See Note 1)
Rating
Symbol
Value
Unit
Power Supply Voltage
Voltage Relative to VSS
(See Note 2)
VDD
Vin, Vout
– 0.5 to + 4.6
– 0.5 to VDD + 0.5
V
V
Input Voltage Three State I/O
(See Note 2)
VIT
VSS – 0.5 to VDD + 0.5
V
Output Current (per I/O)
Iout
± 20 mA
Power Dissipation
PD 4.6 W
Temperature Under Bias
Tbias
– 10 to + 85
°C
Storage Temperature
Tstg
– 55 to + 125
°C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. This is a steady–state DC parameter that is in effect after the power supply has
achieved its nominal operating level. Power sequencing can not be controlled and
is not allowed.
3. Power dissipation capability is dependent upon package characteristics and use
environment. See Package Thermal Characteristics.
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised that
normal precautions be taken to avoid application
of any voltage higher than maximum rated volt-
ages to this high–impedance circuit.
PACKAGE THERMAL CHARACTERISTICS — PBGA
Rating
Symbol
Max Unit Notes
Junction to Ambient (@ 200 lfm)
Single Layer Board
Four Layer Board
RθJA
41 °C/W 1, 2
19
Junction to Board (Bottom)
RθJB
11
°C/W
3
Junction to Case (Top)
RθJC
19
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method
1012.1).
MOTOROLA FAST SRAM
MCM72F10
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MCM72F10DG8 arduino
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado, 80217. 1-303-675-2140 or 1-800-441-2447
Mfax is a trademark of Motorola, Inc.
JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 141,
4-32-1 Nishi-Gotanda, Shagawa-ku, Tokyo, Japan. 03-5487-8488
Mfax: [email protected] – TOUCHTONE 1-602-244-6609
Motorola Fax Back System
– US & Canada ONLY 1-800-774-1848
– http://sps.motorola.com /mfax /
HOME PAGE : http://motorola.com/sps /
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
CUSTOMER FOCUS CENTER: 1-800-521-6274
MOTOROLA FAST SRAM
MMCCMM7722FF101/0D
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