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PDF TQHBT Data sheet ( Hoja de datos )
| Número de pieza | TQHBT | |
| Descripción | 100UA Gain Selectable Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Production Process
TQHBT
InGaP HBT Foundry Service
Metal 2 - 4um
Dielectric
Metal 1 - 2um
Metal 1 - 2um
www.DataSheet4U.com
E
B Emitter
Base
C Collector
B
Sub Collector
Dielectric
C
Buffer & Substrate
NiCr
MIM
Metal 0
Isolation Implant
TQHBT Process Cross-Section
General Description
TriQuint’s TQHBT process is a highly reliable InGaP HBT
process with three levels of interconnecting metal. Thick
metal interconnects and high quality passives promote inte-
gration. The thick metal interconnects, which promote en-
hanced thermal management, and high density capacitors
keep die sizes small. MOCVD epitaxial processes are utilized
to grow the active layers. A carbon-doped Base and InGaP
Emitter are utilized for high RF performance consistent with
high reliability. Precision NiCr resistors and high value MIM
capacitors are included. The three metal layers are encapsu-
lated in a high performance dielectric that allows wiring flexi-
bility and plastic packaging simplicity.
Features
• InGaP Emitter Process for High
Reliability and Thermal Stability
• Base Etch Stop for Uniformity
• MOCVD Epitaxy
• High Linearity in PA applications
• High Density Interconnects;
• 2 Global, 1 Local
• Over 6 µm Total Thickness
• Dielectric Encapsulated Metals
• Thick Metal Interconnects:
• Enhanced Thermal Management
• Minimum Die Size
• Effective Base Ballasting for
Maximum Gain
• 150 mm Wafers
• High-Q Passives
• NiCr Thin Film Resistors
• High Value Capacitors
• Backside Vias Optional
• Validated Models and Design
Support
Applications
• Power Amplifiers
• Driver Amplifiers
• Wideband, General Purpose
Amplifiers
• Gilbert Cell Mixers
• VCOs
• Single Supply and Easy Biasing
TriQuint Semiconductor
2300 NE Brookwood Pkwy
Hillsboro, Oregon 97124
Semiconductors for Communications
www.triquint.com
Page 1 of 5; Rev 2.1 8/10/02
Phone: 503-615-9000
Fax: 503-615-8905
Email: [email protected]
1 page  
Production Process
TQHBT
InGaP HBT Foundry Service
Prototyping and Development
• Prototype Development QuickTurn (PDQ):
• Shared Mask Set;
• Run Monthly
• Hot Lot Cycle Time
• Via and Non-Via Options
• Prototype Wafer Option (PWO):
• Customer-specific Masks, Customer Schedule
• 2 wafers delivered
• Hot Lot Cycle Time
www.DataShee•t4UW.coitmh thinning and sawing; optional backside
vias
Design Tool Status
• Design Manual
• Device Library of Circuit Elements: Transistors, Diodes,
Thin Film Resistors, Capacitors, Inductors
• Parameters for Gummel-Poon Model
• Agilent ADS Now
• MWO and PSPICE Now
• Process Corner Models Planned
• Layout Files Available for:
• Cadence, MWO, & ICED Now
• Layout Rule Sets for Design Rule & Layout versus Sche-
matic Check Now
• Qualified Package Models for Supported Package Styles
Training
• GaAs Design Classes:
• Half Day Introduction; Upon Request
• Four Day Technical Training; Fall & Spring at
TriQuint Oregon facility
• For Training & PDQ Schedules please visit:
www.triquint.com/foundry/
Process Qualification Status
• Mature Process based on 10 GHz, 8V Vdd Process for
Military Phased-Array Radar Applications.
• Over 10 Years of Reliability Data Collected.
• Process Qualification Program complete.
• 150mm Wafer Conversion Qualification underway.
• For more information on Quality & Reliability, contact
TriQuint or visit: www.triquint.com/manufacturing/QR/
Applications Support Services
• Tiling of GDSII Stream Files including PCM
• Design Rule Check Services
• Layout versus Schematic Check Services
• Packaging Development Engineering
• Test Development Engineering:
• On-Wafer
• Packaged Parts
• Thermal Analysis Engineering
• Yield Enhancement Engineering
• Part Qualification Services
• Failure Analysis
Manufacturing Services
• Mask Making
• Pre-Production 100 & 150 mm Wafer Fab
• Wafer Thinning
• Wafer Sawing
• Substrate Vias
• DC Die Sort Testing
• RF On-Wafer Testing
• Plastic Packaging
• RF Packaged Part Testing
Please contact your local TriQuint Semiconductor Representative/ Distributor
or Foundry Services Division Marketing for Additional information:
E-mail: [email protected] Phone: (503) 615-9316 Fax: (503) 615-8905
TriQuint Semiconductor
2300 NE Brookwood Pkwy
Hillsboro, Oregon 97124
Semiconductors for Communications
www.triquint.com
Page 5 of 5; Rev 2.1 8/10/02
Phone: 503-615-9000
Fax: 503-615-8905
Email: [email protected]
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet TQHBT.PDF ] | |
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