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Datasheet TSSOP48 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 3 | TSSOP48 | 48-LEAD THIN SHRINK SMALL OUTLINE DIMENSIONS REF.
A A1 A2 b c D E8 E1 e K0 L ° 0.45 6.0 0.5 8° 0.75 0° 0.018 0.17 0.09 12.4 .1 6.2 0.236 0.0197 8° 0.030 0.05 0.9 0.27 0.20 12.6 0.0067 0.0035 0.488 0.318 0.244
mm MIN. TYP. MAX. MIN.
1.2 0.15 0.002
inch TYP. MAX.
0.047 0.006 0.035 0.011 0.0079 0.496
PACKAGE AND PACKING INFORMAT |
 STMicroelectronics |
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| 2 | TSSOP48 | 48L DAISY CHAIN PIN CONNECTIONS DAISY CHAIN TOP VIEW (INTERNAL CONNECTIONS)
48
25
PIN 1
24
DAISY CHAIN NET LIST PINS
PINS 11 ~ 12 13 ~ 14 15 ~ 16 17 ~ 18 19 ~ 20
PINS 21 ~ 22 23 ~ 24 25 ~ 26 27 ~ 28 29 ~ 30
PINS 31 ~ 32 33 ~ 34 35 ~ 36 37 ~ 38 39 ~ 40
PINS 41 ~ 42 43 ~ 44 45 ~ 46 47 ~ 48
1~2 3~4 5~6 7~8 9 ~ 10
NOTES: 1. |
 TopLine |
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| 1 | TSSOP48 | PC board footprint Philips Semiconductors
PC board footprint
Footprint information for reflow soldering of TSSOP48 package
SOT362-1
Hx Gx P2 (0.125) (0.125)
Hy
Gy
By
Ay
C
D2 (4x)
P1 Generic footprint pattern
D1
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS |
 Philips |
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