SDIP30
STMicroelectronics
SDIP30 Thermal Data
Thermal Data
SDIP 30
30 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 µm
molding compound