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Datasheet QFP-A64 Equivalent ( PDF )

N.º Número de pieza Descripción Fabricantes PDF
1 QFP-A64   LSI Assembly

LSI Assembly QFP-A64 (Units : mm) • QFP-A64 16.4 14.0 48 49 33 32 16.4 14.0 64 1 16 17 H=2.85Max. The contents described herein are subject to change without notice. DataSheet 4 U .com Appendix Notes No technical content pages of this document m
ROHM Semiconductor
ROHM Semiconductor
datasheet QFP-A64 pdf

QFP- Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza Descripción Fabricantes PDF
QFP-EP

Exposed Pad Quad Flat Pack

QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES • Body Sizes: 7 x 7mm to 24 x 24mm • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep) • Lead Counts: 3
STATS ChipPAC
STATS ChipPAC
datasheet pdf - STATS ChipPAC
QFP-A64

LSI Assembly

LSI Assembly QFP-A64 (Units : mm) • QFP-A64 16.4 14.0 48 49 33 32 16.4 14.0 64 1 16 17 H=2.85Max. The contents described herein are subject to change without notice. DataSheet 4 U .com Appendix Notes No technical content page
ROHM Semiconductor
ROHM Semiconductor
datasheet pdf - ROHM Semiconductor
QFP-SD

Stacked Die Quad Flat Pack

QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES • Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integratin
STATS ChipPAC
STATS ChipPAC
datasheet pdf - STATS ChipPAC


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Número de pieza Descripción Fabricantes PDF
SPS122

Modern EU gaming Machines require increased +12V current to accommodate the latest gaming peripherals. DC Converters have been engineered with Sanken’s latest technology to efficiently convert redundant power from our lamp gaming PSU and provide additional +12V capacity at the point of use.

Sanken
Sanken
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