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MSC81450M RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . . . . . . REFRACTORYGOLD METALLIZATION RUGGEDIZED VSWR 25:1 INTERNAL INPUT/OUTPUT MATCHING LOW THERMAL RESISTANCE METAL/CERAMIC HERMETIC PACKAGE POUT = 450 W MIN. WITH 7.0 dB GAIN .400 x .500 2LF L (S038) hermetically sealed ORDER CODE M
Freescale Semiconductor Data Sheet: Document Number: MSC8144E Rev. 14, 5/2010 MSC8144E Quad Core Digital Signal Processor FC-PBGA–783 29 mm × 29 mm • Four StarCore® SC3400 DSP subsystems, each with an SC3400 DSP core, 16 Kbyte L1 instruction cache, 32 Kbyte L1 data cache, memory management
Freescale Semiconductor Data Sheet: Product Preview Document Number: MSC8144 Rev. 1, 5/2007 MSC8144 FC-PBGA–783 29 mm × 29 mm Quad Core Digital Signal Processor • Four StarCore™ SC3400 DSP subsystems, each with an SC3400 DSP core, 16 Kbyte L1 instruction cache, 32 Kbyte L1 data cache, memo
MSC81402 RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIERS APPLICATIONS . . . . . PRELIMINARY DATA REFRACTORY/GOLD METALLIZATION HIGH GAIN & COLLECTOR EFFICIENCY RUGGED OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE POUT = 2.0 W MIN. WITH 10.0 dB GAIN .250 2LFL (S010) hermetically sealed ORD
MSC81400M RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . . . . . . REFRACTORYGOLD METALLIZATION RUGGEDIZED VSWR 25:1 INTERNAL INPUT/OUTPUT MATCHING LOW THERMAL RESISTANCE METAL/CERAMIC HERMETIC PACKAGE POUT = 400 W MIN. WITH 6.5 dB GAIN .400 x .500 2LFL (S038) hermetically sealed ORDER CODE MS
MSC81350M RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS . . . . . . REFRACTORY/GOLD METALLIZATION RUGGEDIZED VSWR 20:1 INTERNAL INPUT/OUTPUT MATCHING LOW THERMAL RESISTANCE METAL/CERAMIC HERMETIC PACKAGE P OUT = 350 W MIN. WITH 7.0 dB GAIN .400 x .400 2NLFL (S042) hermetically sealed ORDER CODE
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