IDT74FCT163827BPV
Integrated Device Technology
3.3V CMOS 20-BIT BUFFERS3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) •
IDT74FCT163827BPF
3.3V CMOS 20-BIT BUFFERS3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Packages include 25 mil pitch SSOP, 19.6
Integrated Device Technology
PDF
IDT74FCT163827BPA
3.3V CMOS 20-BIT BUFFERS3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Packages include 25 mil pitch SSOP, 19.6
Integrated Device Technology
PDF
IDT74FCT163827B
3.3V CMOS 20-BIT BUFFERS3.3V CMOS 20-BIT BUFFERS
Integrated Device Technology, Inc.
IDT74FCT163827A/B/C
FEATURES:
• 0.5 MICRON CMOS Technology • Typical tSK(o) (Output Skew) < 250ps • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Packages include 25 mil pitch SSOP, 19.6
Integrated Device Technology
PDF