파트넘버.co.kr DIP20 데이터시트 검색

DIP20 전자부품 데이터시트



DIP20 전자부품 회로 및
기능 검색 결과



DIP20  

ETC
ETC

DIP20

Thermal Data

® Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver glue ) epoxy resin 0.25 mm 10-40 µm molding compound 3 mm 0.0063W/cm°C Typ




관련 부품 DIP 상세설명

DIP15-2Axx-xx  

  
(DIP Series) Molded DIP Reed Relays

MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configuratio



MEDER
MEDER

PDF



DIP15-1Bxx-xx  

  
(DIP Series) Molded DIP Reed Relays

MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configuratio



MEDER
MEDER

PDF



DIP12-2Axx-xx  

  
(DIP Series) Molded DIP Reed Relays

MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configuratio



MEDER
MEDER

PDF



DIP12-1Bxx-xx  

  
(DIP Series) Molded DIP Reed Relays

MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configuratio



MEDER
MEDER

PDF



DIP110  

  
Diode ( Rectifier )



American Microsemiconductor
American Microsemiconductor

PDF



DIP108  

  
Diode ( Rectifier )



American Microsemiconductor
American Microsemiconductor

PDF




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