파트넘버.co.kr CPZ28 데이터시트 검색

CPZ28 전자부품 데이터시트



CPZ28 전자부품 회로 및
기능 검색 결과



CPZ28  

centralsemi
centralsemi

CPZ28

0.5 Watt Zener Diode Chip

PROCESS Zener Diode CPZ28 0.5 Watt Zener Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 13 x 13 MILS 7.8 MILS 7.0 x 7.0 MILS Ti/Al - 13,000Å Au-As - 13,000Å G




관련 부품 CPZ 상세설명

CPZ40X  

  
5 Volt TVS Chip

PROCESS 5 Volt TVS Chip CPZ40X Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization Back Side Metalization 13.4 x 13.4 MILS 5.5 MILS 3.9 x 6.7 MILS Al - 30,000Å Au - 9,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 122,493 PRINCIPAL DEVIC



centralsemi
centralsemi

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CPZ36R  

  
5.0 Volt TVS Chip

PROCESS 5.0 Volt TVS Chip CPZ36R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization Back Side Metalization 10.2 x 10.2 MILS 3.9 MILS 7.1 MILS DIAMETER Al - 30,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 163,034 PRINCIPAL



centralsemi
centralsemi

PDF



CPZ35R  

  
3.3 Volt TVS Chip

PROCESS 3.3 Volt TVS Chip CPZ35R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization Back Side Metalization 10.2 x 10.2 MILS 3.9 MILS 7.1 MILS DIAMETER Al - 30,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 163,034 PRINCIPAL



centralsemi
centralsemi

PDF



CPZ37R  

  
12 Volt TVS Chip

PROCESS 12 Volt TVS Chip CPZ37R Transient Voltage Suppressor PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 6.7 x 6.7 MILS 3.54 MILS 4.3 x 4.3 MILS Al - 13,000Å Au-As/Ag - 13,000Å/6,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 368,512 PR



centralsemi
centralsemi

PDF



CPZ33R  

  
12 Volt Quad TVS Chip

PROCESS CPZ33R Transient Voltage Suppressor 12 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Metalization Back Side Metalization 14.2 x 14.2 MILS 3.9 MILS 4.7 MILS DIAMETER EACH Al - 13,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 84,



centralsemi
centralsemi

PDF



CPZ39R  

  
5 Volt Quad TVS Chip

PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Metalization Back Side Metalization 11 x 11 MILS 3.94 MILS 3.54 MILS DIAMETER EACH Al - 30,000Å Au - 9,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 140,490



centralsemi
centralsemi

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